ASML | KitGuru https://www.kitguru.net KitGuru.net - Tech News | Hardware News | Hardware Reviews | IOS | Mobile | Gaming | Graphics Cards Wed, 23 Mar 2022 16:55:44 +0000 en-US hourly 1 https://wordpress.org/?v=6.4.3 https://www.kitguru.net/wp-content/uploads/2021/06/cropped-KITGURU-Light-Background-SQUARE2-32x32.png ASML | KitGuru https://www.kitguru.net 32 32 ASML CEO believes lack of machines could extend chip shortage https://www.kitguru.net/channel/generaltech/joao-silva/asml-ceo-believes-lack-of-machines-could-extend-chip-shortage/ https://www.kitguru.net/channel/generaltech/joao-silva/asml-ceo-believes-lack-of-machines-could-extend-chip-shortage/#respond Wed, 23 Mar 2022 09:00:11 +0000 https://www.kitguru.net/?p=554398 To compensate for the lack of semiconductors worldwide, many companies announced plans to create fabs to increase wafer output. However, a fab needs machines to be productive, and most of these machines come from the same place – ASML. If you think about it for a minute, you might already see where the problem is. …

The post ASML CEO believes lack of machines could extend chip shortage first appeared on KitGuru.]]>
To compensate for the lack of semiconductors worldwide, many companies announced plans to create fabs to increase wafer output. However, a fab needs machines to be productive, and most of these machines come from the same place ASML.

If you think about it for a minute, you might already see where the problem is. ASML is the biggest photolithography (EUV) machine manufacturer in the world. That means chipmakers like TSMC and Intel will heavily depend on the dutch company to populate the fabs currently under construction with machines.

According to Financial Times (via TechPowerUp), ASML's CEO believes the company isn't currently up to the task. The fabs under construction should still take two years to start producing, but that can only happen if ASML can also increase its production output.

Peter Wennink, CEO of ASML, stated that the company will ship more machines during 2022 than in 2021, and the same should happen in 2023 compared to 2022. Still, “more” might not be enough, as Wennink points out. Based on the demand curve, ASML would need to increase its production capacity by over 50% to meet the clients' needs.

ASML's CEO added the company is already working with its suppliers to increase its output. Hopefully, the extra capacity will come in time to prevent further chip shortages.

KitGuru says: Lately, we have seen signs that the chip situation is improving. For example, GPUs and consoles have become more widely available and affordable. However, this might not last long if fabs can't get the machines they need to produce chips. 

The post ASML CEO believes lack of machines could extend chip shortage first appeared on KitGuru.]]>
https://www.kitguru.net/channel/generaltech/joao-silva/asml-ceo-believes-lack-of-machines-could-extend-chip-shortage/feed/ 0
TSMC plans to use EUV lithography for 5nm process technology https://www.kitguru.net/components/graphic-cards/anton-shilov/tsmc-plans-to-use-euv-lithography-for-5nm-process-technology/ https://www.kitguru.net/components/graphic-cards/anton-shilov/tsmc-plans-to-use-euv-lithography-for-5nm-process-technology/#respond Tue, 21 Jul 2015 20:08:02 +0000 http://www.kitguru.net/?p=260076 For quite a while, Taiwan Semiconductor Manufacturing Co. has been talking about using extreme ultraviolet (EUV) lithography for its advanced 10nm process technology. However, since appropriate scanners are not ready and will not be for at least a couple of years, the company will be unable to take advantage of EUV for a long time. …

The post TSMC plans to use EUV lithography for 5nm process technology first appeared on KitGuru.]]>
For quite a while, Taiwan Semiconductor Manufacturing Co. has been talking about using extreme ultraviolet (EUV) lithography for its advanced 10nm process technology. However, since appropriate scanners are not ready and will not be for at least a couple of years, the company will be unable to take advantage of EUV for a long time. At present, TSMC intends to use EUV only for its 5nm fabrication process, which is due in four to five years from now.

Extreme ultraviolet lithography scanners feature lasers with 13.5nm wavelength that allow to “draw” finer features of chips and eliminate many challenging technologies that have to be used today in conjunction with current-gen lithography tools. In particular, EUV will eliminate need for multi-patterning, will shrink cycle times and will help to improve yields of chips made using leading-edge process technologies.

tsmc_wafer_semiconductor_chip_300mm_fab

Right now EUV scanners are not ready for commercial production of chips and ASML, a leading maker of semiconductor production equipment, is working closely with TSMC and other leading makers of chips to prepare the new devices. TSMC plans to try EUV with its 7nm fabrication process in 2017 – 2018 and then use it commercially to make chips using 5nm manufacturing technology.

“As you can see in our 7nm development schedule that probably will not using EUV,” said Mark Liu, president and co-CEO of TSMC, during the company’s earnings conference call with investors and financial analysts. “But we are planning to exercise EUV using the 7nm technology and currently we are planning to use EUV at 5nm. But of course it does depend certain development criteria, milestones to be reached.”

tsmc_wafer_semiconductor_chip_300mm_fab_1

At present TSMC expects to start volume production of chips using 7nm process technology sometimes in the first half of 2018. Considering how aggressively the company intends to introduce new manufacturing processes going forward, it is possible that it will start trial production using 5nm EUV process technology in 2018 – 2019 timeframe.

“[EUV] has a good benefit from our assessment […] on the 5nm that reduce[s] a lot of masking layers and increase[s] a lot of better control for the 5nm,” said Mr. Liu.

Intel Corp. plans to use EUV tools for production using 7nm fabrication process towards the end of the decade.

Discuss on our Facebook page, HERE.

KitGuru Says: Based on the comments recently made by Intel and TSMC, it is obvious that extreme ultraviolet lithography will only become commercially viable in 2019 – 2020. Until then, chipmakers will have to deal with multi-patterning and all the associated problems, which is not a good news for smaller chip designers.

The post TSMC plans to use EUV lithography for 5nm process technology first appeared on KitGuru.]]>
https://www.kitguru.net/components/graphic-cards/anton-shilov/tsmc-plans-to-use-euv-lithography-for-5nm-process-technology/feed/ 0
ASML sells 15 EUV lithography scanners, possibly, to Intel https://www.kitguru.net/components/graphic-cards/anton-shilov/asml-sells-15-euv-lithography-scanners-possibly-to-intel/ https://www.kitguru.net/components/graphic-cards/anton-shilov/asml-sells-15-euv-lithography-scanners-possibly-to-intel/#comments Thu, 23 Apr 2015 22:59:44 +0000 http://www.kitguru.net/?p=246460 ASML Holding NV, one of the world’s leading makers of semiconductor manufacturing equipment, this week said that it had signed an agreement with one of its major U.S.-based customers to deliver at least 15 ASML extreme ultraviolet (EUV) EUV lithography systems. Given the scale of the order it is highly likely that ASML’s customer is Intel …

The post ASML sells 15 EUV lithography scanners, possibly, to Intel first appeared on KitGuru.]]>
ASML Holding NV, one of the world’s leading makers of semiconductor manufacturing equipment, this week said that it had signed an agreement with one of its major U.S.-based customers to deliver at least 15 ASML extreme ultraviolet (EUV) EUV lithography systems. Given the scale of the order it is highly likely that ASML’s customer is Intel Corp.

ASML indicated that the systems will be used to support increased development activity and pilot production of future-generation manufacturing processes. In particular, the owner of the equipment plans to use EUV lithography for multiple processing steps in “future process technology nodes”, but ASML did not reveal which ones. At present it is believed that Intel will use EUV for making chips using 7nm and 5nm process technologies.

The first two NXE:3350B EUV systems are expected to be delivered before the end of 2015. The new systems will be in addition to the existing EUV development systems already at the customer.

So far ASML has shipped less than ten NXE:3300B EUV test systems to clients. Last year the company began to upgrade light source inside test systems to boost their productivity to 500 wafers per 24 hours. For high-volume manufacturing a wafer scanner should process 1500+ wafers per 24 hours. Previously it was expected that the semiconductor industry would use EUV lithography starting from 2015-2016 and 10nm process technology. Since there are no scanners with proper characteristics today, EUV lithography will only be adopted sometimes in 2017 or later.

asml_twinscan

Extreme ultraviolet lithography is the leading new patterning technology that allows semiconductor manufacturers to continue scaling down feature sizes of chips. Thanks to 13.5nm wavelength of EUV lasers, it will be possible to “draw” finer elements of chips without using tricky multiple-patterning techniques and implementing additional metal layers that complicate production process and make it more expensive. EUV also promises to bring significant benefits in terms of yield and cycle time.

“EUV is now approaching volume introduction. Long-term EUV planning and EUV ecosystem preparation is greatly supported by this commitment to EUV, kick-starting a new round of innovation in the semiconductor industry,” said Peter Wennink, chief executive officer of ASML. “The commitment extends the planning horizon and increases the confidence in EUV.”

Financial terms were not disclosed, but is the deal is worth hundreds of millions of dollars.

Discuss on our Facebook page, HERE.

KitGuru Says: The order of 15 systems proves that EUV lithography will be used for mass production of chips. The question is when.

The post ASML sells 15 EUV lithography scanners, possibly, to Intel first appeared on KitGuru.]]>
https://www.kitguru.net/components/graphic-cards/anton-shilov/asml-sells-15-euv-lithography-scanners-possibly-to-intel/feed/ 1
Intel: Moore’s law will last for another 10 years https://www.kitguru.net/components/graphic-cards/anton-shilov/intel-moores-law-will-last-for-another-10-years/ https://www.kitguru.net/components/graphic-cards/anton-shilov/intel-moores-law-will-last-for-another-10-years/#comments Wed, 08 Apr 2015 22:59:40 +0000 http://www.kitguru.net/?p=244089 Intel Corp. predicts that Moore’s law will last for at least another decade and the number of transistors per chip will keep doubling every two years. While there are challenges ahead, Intel’s engineers are going to solve them. Later this month Moore’s law will hit 50 years, an unprecedented date for the industry, where every innovation gets …

The post Intel: Moore’s law will last for another 10 years first appeared on KitGuru.]]>
Intel Corp. predicts that Moore’s law will last for at least another decade and the number of transistors per chip will keep doubling every two years. While there are challenges ahead, Intel’s engineers are going to solve them.

Later this month Moore’s law will hit 50 years, an unprecedented date for the industry, where every innovation gets outdated in a couple of years. In fact, the very reason why Moore’s Law still lasts is because every breakthrough in development of semiconductors is succeeded by another one 24 months after introduction, enabling chip designers to double the amount of transistors per chip. According to Intel Corp., the evolution of semiconductors will continue at the rapid pace and the law will last for at least 10 more years. Or, maybe, longer.

“We can see about 10 years ahead, so our research group has identified some promising options [for 7nm and 5nm] not yet fully developed, but we think we can continue Moore's Law for at least another 10 years,” said Mark Bohr, director of process architecture and integration at Intel, during a special event, reports V3.

intel_ireland_semiconductor_chip_fab_300mm_wafer_8

Intel notes that since research and development of manufacturing technologies is a serial process, it is almost impossible to accurately predict which challenges will arise, which will be solved and which could mean the end of Moore’s law. When it comes to fabrication technologies, Intel has horizon of around 10 years.

“If you had asked me 10 or 20 years ago, I would have given you the same answer: our visibility back then was about 10 years into the future,” said Mr. Bohr. “It is fair to say that eventually Moore's law will slow down or come to an end, but we do not see that in the imminent future.”

Mr. Bohr confirmed that Intel is looking at so-called ‘III-V' materials from the third and fifth columns of the periodic table for potential use in the transistor channel instead of hafnium-based dielectrics used today, but did not elaborate. He also did not reveal any thoughts regarding materials like graphene or possible use of new transistor structures, such as gate-all-around FETs. In GAA FETs gate material surrounds the channel region on all sides; GAA FETs can have two or four effective gates. Intel's tri-gate transistors used today have three gates.

intel_semiconductor_intel_custom_foundry_alley-with-worker-in-fab-16x9

Since Moore’s law is generally an economic law, not only a technology transition law, it can transform, evolve or go into a different direction eventually. For example, instead of reducing sizes of transistors, producers of chips could start stacking components on top of each other, thus increasing integration.

Discuss on our Facebook page, HERE.

KitGuru Says: Since Intel is already researching options for 7nm and 5nm fabrication technologies, whereas ASML is studying technologies needed to design equipment that will be used to produce chips using 3nm and 2nm manufacturing processes, there are no doubts that Moore's law will continue to live for another ten or more years. However, a big question is how many companies will have capital to develop new manufacturing technologies and acquire appropriate tools going forward…

The post Intel: Moore’s law will last for another 10 years first appeared on KitGuru.]]>
https://www.kitguru.net/components/graphic-cards/anton-shilov/intel-moores-law-will-last-for-another-10-years/feed/ 2
TSMC looking at new materials, transistor structures for sub-10nm tech https://www.kitguru.net/components/anton-shilov/tsmc-looking-at-advanced-materials-new-transistor-technologies-for-sub-10nm-tech/ https://www.kitguru.net/components/anton-shilov/tsmc-looking-at-advanced-materials-new-transistor-technologies-for-sub-10nm-tech/#respond Sat, 04 Apr 2015 18:58:29 +0000 http://www.kitguru.net/?p=243736 Taiwan Semiconductor Manufacturing Co. this week confirmed that it has a team of engineers working on a manufacturing process that will succeed 10nm fabrication technology towards the end of the decade. While the company did not reveal details about its sub-10nm process, it said that it considers various options for it, including new lithography tools, …

The post TSMC looking at new materials, transistor structures for sub-10nm tech first appeared on KitGuru.]]>
Taiwan Semiconductor Manufacturing Co. this week confirmed that it has a team of engineers working on a manufacturing process that will succeed 10nm fabrication technology towards the end of the decade. While the company did not reveal details about its sub-10nm process, it said that it considers various options for it, including new lithography tools, transistor structures and materials.

“We are working on future platform technology development,” said Suk Lee, senior director of design infrastructure marketing division of TSMC in an interview with Cadence. “We have a team working on the next generation after 10nm. Those technologies are going to be offered in the 2017 to 2019 period. We do not anticipate Moore's Law is going to slow down anytime soon.”

semiconductor_wafer_cadence_4645_TSMC-Fab3inr008_78-sized

Back in February Intel Corp. and Samsung Electronics confirmed that their research and development (R&D) teams are already working on 7nm manufacturing technologies that will be used to make highly-sophisticated computer chips. Intel confirmed that it was looking at all-new materials for its 7nm production process. Recently rumours emerged that the chipmaker is working with Honeywell, a multinational conglomerate company with a lot of expertise in chemistry and high tech, on the materials for its 7nm manufacturing tech. Samsung Electronics said that it was considering switching to a new transistor structure from FinFET/tri-gate. According to the company, gate-all-around FETs will be viable at 7nm and beyond. Samsung also implied that it would look at new materials for its 7nm fabrication process as well.

TSMC constantly makes updates regarding progress of its preparations to manufacturing using 10nm fabrication process and makes no secret that its process technology options are rather flexible. For example, TSMC is working with ASML, a leading maker of semiconductor manufacturing equipment, on a mid-node insertion of extreme ultraviolet lithography (EUV) at the 10nm logic node, which is expected to happen in late 2016. However, the company has always been tight-lipped on its processes beyond 10nm. In fact, the company even does not want to talk about exact feature size of the process.

“I do not want to make any comment on a specific technology node number,” said Mr. Lee.

But while we do not know what is exactly TSMC developing, the director of design infrastructure marketing division of TSMC revealed that the company is – just like its rivals – considering new materials and new transistor structures for its sub-10nm fabrication process.

“We are looking at advanced materials, different kinds of transistor technologies,” said Mr. Lee.

tsmc_semiconductor_fab14_production_4

In fact, keeping in mind that TSMC definitely wants to use EUV lithography at some point, it is more concerned about tools rather than transistor structures or materials. Obviously, the company is working in different directions and at some point will make decisions regarding exact materials and transistor structures for its sub-10nm process tech. However, the EUV-related challenges preserve the company from making any announcements today.

“But the immediate next big challenge has to do with continuing the ability to do patterning based on existing light sources,” stated the high-ranking TSMC rep. “At 10nm, no one is dependent on EUV. We have set up our 10nm technology so that when and if EUV comes on line we can take advantage of it. We continue to work with ASML on EUV tools. The technology itself is very complex. We need to get to a point where there's sufficient wattage and uptime so there are significant wafer volumes.”

Discuss on our Facebook page, HERE.

KitGuru Says: 7nm process technology will not be used for commercial chips until at least 2019. However, three leading semiconductor companies – Intel, Samsung and TSMC – are already developing manufacturing processes to produce chips for your 2020 smartphone, tablet and PC.

The post TSMC looking at new materials, transistor structures for sub-10nm tech first appeared on KitGuru.]]>
https://www.kitguru.net/components/anton-shilov/tsmc-looking-at-advanced-materials-new-transistor-technologies-for-sub-10nm-tech/feed/ 0
ASML readies equipment to produce 5nm chips https://www.kitguru.net/components/anton-shilov/asml-readies-equipment-to-produce-5nm-chips/ https://www.kitguru.net/components/anton-shilov/asml-readies-equipment-to-produce-5nm-chips/#respond Thu, 27 Nov 2014 04:46:45 +0000 http://www.kitguru.net/?p=223779 We do not know exactly when companies like Intel Corp., Samsung Electronics or Taiwan Semiconductor Manufacturing Co. make their first chips using 7nm, 5nm, 3nm or 2nm process technologies. But we do know what should happen before leading semiconductor producers manufacture their new chips using ultra-thin process technologies: ASML should sell them appropriate tools to do …

The post ASML readies equipment to produce 5nm chips first appeared on KitGuru.]]>
We do not know exactly when companies like Intel Corp., Samsung Electronics or Taiwan Semiconductor Manufacturing Co. make their first chips using 7nm, 5nm, 3nm or 2nm process technologies. But we do know what should happen before leading semiconductor producers manufacture their new chips using ultra-thin process technologies: ASML should sell them appropriate tools to do so.

At its investor day in London earlier this week ASML outlined its roadmap till 2019 – 2020. The world’s largest producer of lithography equipment for production of chips believes that while current-generation deep ultraviolet (DUV) with multi-patterning as well as other ways of shrinking geometry of integrated circuits will work for a number of years to come, eventually makers of chips – whether they manufacture memory or logic – will have to transit to extreme ultraviolet lithography (EUV). In general, the industry experts agree with ASML, so when it comes to sub-10nm fabrication processes, the chipmakers and ASML invest a lot in EUV.

asml_nxe3000_nxe3500_euv_roadmap_4

At present ASML offers NXE:3300B semi-experimental EUV scanner (which will be upgraded in 2015 – 2016 with new light source to support commercial production volumes) as well as NXE:3350B EUV scanner to makers of semiconductors. The scanners support 16nm half-pitch (HP) resolution and are expected to be used for production of chips using 10nm and 7nm process technologies. However, to support thinner process technologies new manufacturing equipment will be needed.

asml_nxe3000_nxe3500_euv_roadmap_5

To make chips using 5nm fabrication process, ASML believes that it will need to reduce the the half-pitch resolution of the generated patterns to 13nm. To do so, the company plans to upgrade the NXE:3350B and to introduce its all-new NXE:3400B EUV scanners in the second half of 2017 or sometimes in 2018. Using the new equipment, semiconductor manufacturers will be able to start learning how to make integrated circuits using 5nm manufacturing technology in 2018, more than two years before such chips will be made commercially.

In addition to development of its NXE:3350B OFP and NXE:3400B scanners ASML already envisions requirements for semiconductor manufacturing equipment that will be used around ten years from now to make chips using 3nm and 2nm process technologies.

Discuss on our Facebook page, HERE.

KitGuru Says: Despite of the fact that many predict the end for Moore’s Law, it looks like it will continue to be valid for another ten years. At least, ASML and Intel clearly think so.

The post ASML readies equipment to produce 5nm chips first appeared on KitGuru.]]>
https://www.kitguru.net/components/anton-shilov/asml-readies-equipment-to-produce-5nm-chips/feed/ 0
TSMC to have four EUV scanners in 2015, to use EUV tools for 10nm chips https://www.kitguru.net/components/anton-shilov/tsmc-to-have-four-euv-scanners-in-2015-to-use-euv-tools-for-10nm-chips/ https://www.kitguru.net/components/anton-shilov/tsmc-to-have-four-euv-scanners-in-2015-to-use-euv-tools-for-10nm-chips/#respond Wed, 26 Nov 2014 23:47:08 +0000 http://www.kitguru.net/?p=223727 Taiwan Semiconductor Manufacturing Co. has ordered two additional extreme ultraviolet (EUV) lithography scanners from ASML Holding. The equipment will be delivered in 2015 and will complement initial two EUV scanners TSMC has today, which will be upgraded. Four scanners will let TSMC make chips using 10nm process technology and EUV lithography tech in commercial quantities. Next …

The post TSMC to have four EUV scanners in 2015, to use EUV tools for 10nm chips first appeared on KitGuru.]]>
Taiwan Semiconductor Manufacturing Co. has ordered two additional extreme ultraviolet (EUV) lithography scanners from ASML Holding. The equipment will be delivered in 2015 and will complement initial two EUV scanners TSMC has today, which will be upgraded. Four scanners will let TSMC make chips using 10nm process technology and EUV lithography tech in commercial quantities.

Next year ASML will deliver two NXE:3350B EUV systems to TSMC. In addition, ASML will upgrade TSMC’s existing NXE:3300B systems with new light sources that will increase their production capacity to the levels of NXE:3350B, which will allow the world’s largest contract maker of semiconductors to start volume commercial production of 10nm chips using EUV lithography equipment sometimes in 2016 – 2017.

asml_nxe3000_nxe3500_euv_roadmap

At present ASML’s NXE:3300B scanners – which are installed at various semiconductor manufacturing facilities across the world – feature 80W light sources and can process about or over 500 wafers per day. Sometimes next year ASML will have 125W light sources for the NXE:3300B and the NXE:3350B systems, which will boost their productivity to 1000+ wafers per day, which may be nearly enough to start commercial usage. In 2016 the company plans to supply 250W light sources that will further increase productivity to 1500 wafers per day.

asml_nxe3000_nxe3500_euv_roadmap_1

While ASML itself has a solid roadmap for EUV equipment in place and everything depends on whether it can deliver more powerful light sources on time, other companies are only ready with EUV infrastructure acceptable for 10nm node. Improvements are required for volume production at 7nm node. Meanwhile, Intel Corp. and, apparently, some other big players, only plan to adopt EUV at 7nm.

asml_nxe3000_nxe3500_euv_roadmap_3

Discuss on our Facebook page, HERE.

KitGuru Says: With four EUV scanners installed, TSMC will clearly make the majority of its 10nm chips using EUV lithography, which may provide it a lot of benefits compared to other foundries, if all goes well. But what if it does not?

The post TSMC to have four EUV scanners in 2015, to use EUV tools for 10nm chips first appeared on KitGuru.]]>
https://www.kitguru.net/components/anton-shilov/tsmc-to-have-four-euv-scanners-in-2015-to-use-euv-tools-for-10nm-chips/feed/ 0
ASML: EUV tools continue to make progress, adoption to start in 2016 https://www.kitguru.net/components/graphic-cards/anton-shilov/asml-euv-tools-continue-to-make-progress-adoption-to-start-in-2016/ https://www.kitguru.net/components/graphic-cards/anton-shilov/asml-euv-tools-continue-to-make-progress-adoption-to-start-in-2016/#respond Thu, 16 Oct 2014 11:22:52 +0000 http://www.kitguru.net/?p=216944 Although Intel Corp. does not plan to use lithography with extreme ultraviolet (EUV) wavelength with its 10nm fabrication process, it looks like other makers of semiconductors still pin hopes to take advantage of the EUV in connection with 10nm technology. ASML, one of the leading producers of semiconductor manufacturing tools, on Wednesday made an update …

The post ASML: EUV tools continue to make progress, adoption to start in 2016 first appeared on KitGuru.]]>
Although Intel Corp. does not plan to use lithography with extreme ultraviolet (EUV) wavelength with its 10nm fabrication process, it looks like other makers of semiconductors still pin hopes to take advantage of the EUV in connection with 10nm technology.

ASML, one of the leading producers of semiconductor manufacturing tools, on Wednesday made an update regarding progress of its EUV [extreme ultraviolet] lithography equipment. The company indicated that it has upgraded its NXE:3300B systems at customers’ sites to manufacture more wafers per hour than it was previously possible. It also revealed that it is on-track to ship NXE:3350B systems suitable for commercial production of chips using extreme ultraviolet lithography in 2016. Moreover, there is at least one customer interested in using it with 10nm fabrication process.

So far ASML shipped six NXE:3300B EUV test systems to customers. Previously the tools were only capable of processing 200 300mm wafers per 24 hours. Thanks to upgrade of the EUV light source inside the test systems, they are now capable of processing 500 wafers per 24 hours. Meanwhile, for high-volume manufacturing wafer scanners should process 1500+ wafers per 24 hours.

“Our EUV program showed substantial progress in the quarter,” said Peter Wennink, president and chief executive officer of ASML. “All installed NXE:3300B systems have been upgraded to a wafer processing capability of more than 500 wafers per day. Two customers conducted endurance tests that demonstrated this capability of more than 500 wafers in a 24-hour period. We continue executing programs that should consistently deliver this level of performance, which our customers require by the end of the year.”

asml_euv

Previously it was expected that the semiconductor industry (i.e., leading makers of chips like Intel) would use EUV lithography starting from 2015 and 10nm process technology. However, delays at ASML postponed adoption of EUV lithography and, for example, Intel has no plans to use the tech for 10nm production. Still, ASML claims that there is an unknown customer planning to start using EUV in late 2016 with 10nm process technology.

asml_euv_1

“We are working with a customer towards a mid-node insertion of EUV at the 10nm logic node expected in late 2016,” said Mr. Wennink. “Other customers are preparing for initial learning in a manufacturing environment. In this scenario we expect to ship around six NXE:3350B systems starting mid-2015, on top of the three NXE:3300B systems that will be converted to NXE:3350B configuration.”

asml_euv_2

Discuss on our Facebook page, HERE.

KitGuru Says: It is not completely clear what the “mid-node insertion” is. By late 2016 only Intel and TSMC are expected to have more or less ready 10nm process technology. Both companies require extremely high volumes and will hardly bother with two types of 10nm fabrication processes: one with EUV, another without EUV. Still, TSMC has confirmed interest to use EUV with 10nm fabrication process for a number of times…

The post ASML: EUV tools continue to make progress, adoption to start in 2016 first appeared on KitGuru.]]>
https://www.kitguru.net/components/graphic-cards/anton-shilov/asml-euv-tools-continue-to-make-progress-adoption-to-start-in-2016/feed/ 0
Intel: We will not need EUV for 10nm process technology https://www.kitguru.net/components/cpu/anton-shilov/intel-we-will-not-need-euv-for-10nm-process-technology/ https://www.kitguru.net/components/cpu/anton-shilov/intel-we-will-not-need-euv-for-10nm-process-technology/#comments Thu, 04 Sep 2014 16:30:23 +0000 http://www.kitguru.net/?p=210313 Intel Corp. officially confirmed on Wednesday that it will not use extreme ultraviolet (EUV) lithography for its 10nm process technology allegedly due to come online in 2016. Apparently, not only the EUV scanners are not ready, but backbones of certain fabs may not support the new equipment due to its dimensions. “We know we can …

The post Intel: We will not need EUV for 10nm process technology first appeared on KitGuru.]]>
Intel Corp. officially confirmed on Wednesday that it will not use extreme ultraviolet (EUV) lithography for its 10nm process technology allegedly due to come online in 2016. Apparently, not only the EUV scanners are not ready, but backbones of certain fabs may not support the new equipment due to its dimensions.

“We know we can get through 10nm without EUV,” said Brian Krzanich, chief executive officer of Intel at the Citi Global Technology Conference.

While it was expected by virtually all industry analysts that Intel would not use extreme ultraviolet lithography for 10nm node, this is the first time when Intel officially confirmed this.

intel_ireland_semiconductor_chip_fab
Inside Intel's fab in Ireland

Both ASML and Nikon, two major producers of semiconductor manufacturing equipment, will be able to supply enough EUV scanners by 2016, when Intel presumably plans to start mass production of 10nm chips. Since EUV is too late for 10nm, Intel will use a tricky multi-patterning approach to produce chips with 10nm feature sizes. Multi-patterning (quad-patterning, according to rumours regarding Intel’s 10nm fabrication process) is a rather expensive and time-consuming semiconductor manufacturing technology.

“We are late with EUV […] and technologies needed for it,” admitted Mr. Krzanich.

intel_ireland_semiconductor_chip_fab_2
Intel's fab in Ireland

The EUV scanners are only a part of the problem. The tools require a lot of other equipment to function and it is unclear whether these machines are ready. Moreover, the backbone tools for EUV scanners are going to be larger than today’s, which means that they may not fit into all current fabs (many of which were not designed for EUV equipment from the start).

“What you always have to remember with fab equipment is kind of like an iceberg,” explained the head of Intel. “What you see in the factory itself is a small percentage of that total tool space. Go underneath and whenever I dig deep on fab source, the fab is kind of neat, but if you go below the fab that is where the real engineers live and that is where the fun is. There is usually much more equipment down below the fab line than on above it: the pumps, the computers and everything else that’s running that machine is down below the fab actually. If you take a look at it an EUV machine it is quite large and footprints inside the clean room is quite big, but the footprint down below is equally or maybe even slightly bigger.”

Intel is expected to demonstrate the first wafers processed using 10nm fabrication technology later this month at the Intel Developer Forum. The company will likely provide an update on the 10nm technology in general at the trade-show too.

Discuss on our Facebook page, HERE.

KitGuru Says: It looks like the EUV is at least four or even five years away. Therefore, it will be interesting to see whether the implementation of the new lithography technology will coincide with adoption of 450mm wafers, which are supposed to enter production late this decade. Keeping in mind all the complexities with new process technologies, it may well happen that Intel and other market players will again choose to postpone 450mm wafers in order to ensure that the EUV and all other innovations (including, but not limited to, new materials) work fine before investing in multi-billion 450mm semiconductor manufacturing facilities.

The post Intel: We will not need EUV for 10nm process technology first appeared on KitGuru.]]>
https://www.kitguru.net/components/cpu/anton-shilov/intel-we-will-not-need-euv-for-10nm-process-technology/feed/ 3
Intel remains committed to 450mm wafers, but there will be a delay https://www.kitguru.net/components/graphic-cards/anton-shilov/intel-remains-committed-to-450mm-wafers-but-there-will-be-a-delay/ https://www.kitguru.net/components/graphic-cards/anton-shilov/intel-remains-committed-to-450mm-wafers-but-there-will-be-a-delay/#respond Thu, 20 Mar 2014 19:27:24 +0000 http://www.kitguru.net/?p=183587 Early last year Intel Corp. demonstrated the world’s first fully-patterned 450mm wafers and in mid-2013 started to construct D1X module 2 fab, which is supposed to act as a primary development facility for virtually all of Intel’s 450mm initiatives. It was expected that commercial production of chips on 450mm wafers would start around the middle …

The post Intel remains committed to 450mm wafers, but there will be a delay first appeared on KitGuru.]]>
Early last year Intel Corp. demonstrated the world’s first fully-patterned 450mm wafers and in mid-2013 started to construct D1X module 2 fab, which is supposed to act as a primary development facility for virtually all of Intel’s 450mm initiatives. It was expected that commercial production of chips on 450mm wafers would start around the middle of the decade, but now the plans have changed and deployment of 450mm facilities was delayed.

ASML, one of the world’s leading suppliers of chip-making equipment, said back in late 2013 that it would slowdown/stop investments into development of tools that process 450mm wafers. Intel, TSMC and Samsung hold a stake in ASML and can potentially influence its decisions. Since neither of chip manufacturers opposed the decision (at least publicly), it looks like there are certain technological problems with the 450mm systems that will take years to solve.

Nonetheless, Intel does not give up hope to use 450mm wafers to produce its chips. While the firm will not be able to do that in 2015 – 2017, it now hopes to initiate 450mm manufacturing later, perhaps, in 2018 – 2019.

“Our position for 450mm has not changed in that we expect deployment sometime in the later part of this decade,” said Intel spokesman Chuck Mulloy. “We adjusted our 450mm funding to ASML consistent with their plans. However, this is not a change in our (2014) capital forecast as it anticipated that change. We continue to work with our industry partners to align on timing.”

intel_450mm_wafer_demo_3

Intel's first 450mm wafer. Image by X-bit labs.

Manufacturers of semiconductors can get 2.5 times more chips from a 450mm wafer than from a 300mm wafer, which reduces per-chip costs. However, 450mm equipment and 450mm fabs cost considerably more than conventional 300mm tools and factories.

A lot of the research and development to move from standard 300mm wafers to 450mm wafers is being done by the Global 450 Consortium of companies established by the New York state government Andrew Cuomo. The G450C includes Intel, IBM, GlobalFoundries and is based in Albany at the SUNY College of Nanoscale Science and Engineering.

KitGuru Says: While the development of 450mm process technologies is facing delays, there are no doubts that at some point in the future the world will need so many chips that the 450mm wafers will be a requirement. The economic situation can improve and accelerate the evolution to 450mm wafers, the only question is when this is supposed to happen…

The post Intel remains committed to 450mm wafers, but there will be a delay first appeared on KitGuru.]]>
https://www.kitguru.net/components/graphic-cards/anton-shilov/intel-remains-committed-to-450mm-wafers-but-there-will-be-a-delay/feed/ 0
Samsung gets into ASML bed with Intel and TSMC https://www.kitguru.net/components/cpu/harrison/samsung-gets-into-asml-bed-with-intel-and-tsmc/ https://www.kitguru.net/components/cpu/harrison/samsung-gets-into-asml-bed-with-intel-and-tsmc/#respond Tue, 28 Aug 2012 08:07:24 +0000 http://www.kitguru.net/?p=106114 Still smarting from having to pay Apple over $1 Billion because it stole design ideas, Samsung has agreed to outlay around half that amount again to pick up 3% of Dutch photolithography firm ASML. It's nice to get something tangible for your money. KitGuru does a quick check on who else bought into the Dutchmen's …

The post Samsung gets into ASML bed with Intel and TSMC first appeared on KitGuru.]]>
Still smarting from having to pay Apple over $1 Billion because it stole design ideas, Samsung has agreed to outlay around half that amount again to pick up 3% of Dutch photolithography firm ASML. It's nice to get something tangible for your money. KitGuru does a quick check on who else bought into the Dutchmen's concern.

Every kid knows that the crayons you start writing with, will only take you so far. After a while, you start to get the hang of writing and drawing and felt tip pens seem like a great idea. At the same time, you move into pencils and things get even more detailed. Sometimes your pencil is blunt, which is great for shading large areas, but if you want detail – then you need to pull out the sharpener. The world's biggest chip companies face almost exactly the same issues when it comes to creating processors.

You always want a sharper pencil and bigger sheet of paper.

ASML's area of expertise is high-tech pencils and paper. More specifically, it's the world's largest supplier of photolithography equipment for the semiconductor industry – with revenues in the $6 Billion range generated by nearly 10,000 staff using assets and machinery valued at nearly $10 Billion. In short, it's a real company with real products, revenue and value. Nice.

To put the importance of ASML in perspective, almost 2/3 of the world's lithography is done on its machines.

So what's changing down at ASML?  Well, it wants to invest a huge amount of money into increasing production for the machines that scribe 450mm wafers, as well as improving and developing extreme ultraviolet (EUV) technology. The closer you move to that end of the wavelength spectrum, the smaller the wavelength and the more narrow you can ‘cut', thereby ‘shrinking' the final product. Going back to our original analogy, Infra Red is crayons and EUV is a needle sharp pencil.

So, ASML needs big investment and customers like Intel, TSMC and Samsung need those machines. It's a marriage made in heaven. So how much of a dowry will the prospective brides be asked to part with?

  • Intel $3.1 Billion for 15%
  • TSMC $1.04 Billion for 5%
  • Samsung $630 Million for 3%

According to an ASML spokeman, no other companies will be invited to invest.

ASML CEO Eric Meurice alongside the company's huge factory in Holland. Around 67% of the world's lithography equipment is produced by the Dutch company - and it's now ready to expand based on investment from TSMC, Intel and Samsung

KitGuru says: We're left wondering if Samsung would have bought the same share as TSMC if Apple had not nabbed the extra $1 Billion first. Probably not, but it's interesting to speculate.

Comment below or in the KitGuru forums.

The post Samsung gets into ASML bed with Intel and TSMC first appeared on KitGuru.]]>
https://www.kitguru.net/components/cpu/harrison/samsung-gets-into-asml-bed-with-intel-and-tsmc/feed/ 0