fab 28 | KitGuru https://www.kitguru.net KitGuru.net - Tech News | Hardware News | Hardware Reviews | IOS | Mobile | Gaming | Graphics Cards Mon, 26 Sep 2022 07:18:20 +0000 en-US hourly 1 https://wordpress.org/?v=6.4.3 https://www.kitguru.net/wp-content/uploads/2021/06/cropped-KITGURU-Light-Background-SQUARE2-32x32.png fab 28 | KitGuru https://www.kitguru.net 32 32 Leo Visits Intel: The Israel Travel VLOG! https://www.kitguru.net/components/cpu/leo-waldock/leo-visits-intel-the-israel-travel-vlog/ https://www.kitguru.net/components/cpu/leo-waldock/leo-visits-intel-the-israel-travel-vlog/#respond Mon, 26 Sep 2022 07:18:20 +0000 https://www.kitguru.net/?p=575601 Leo spent a week in Israel with Intel learning all about their 13th Gen Raptor Lake Core processors. We have already posted some Intel news however the deep dive technical briefings are under NDA until next week. To tide you over we present a travelogue that could be titled 'Leo Eats His Way Around Israel'...

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I recently spent a week in Israel with Intel learning all about their 13th Gen Raptor Lake Core processors. We have already posted some Intel news, however the deep dive technical briefings are under NDA until next week. To tide you over we present a travelogue that could be titled ‘Leo Eats His Way Around Israel'

Timestamps

00:00 Start
00:16 2019 Recap
00:42 Welcome to Fab28
01:08 Schedule with Intel / news and info we can share
02:27 The trip there and Intel in Israel
03:07 Hotel room and location
03:58 Raptor Lake and other tech
05:33 Hark back to Intel Accelerated
06:28 Intel’s Huge claims
07:27 Lunch and NDA briefings / deep dive
07:43 Tuesday events
09:18 Wednesday Fab 28 and Fab 38
10:56 HoloLens 2 Headsets / TwinScan NXT 1980Di
11:45 Leo enjoyed the tour – went for a stroll
12:41 Off to airport

There were three main elements to the Intel trip to Israel. On the Monday we were briefed about Raptor Lake and specifically about the Raptor Cove P-Cores. We also covered an Intel discussion where Isic Silas, Corporate VP in Client Computing Group, gave some background to the development of Raptor Lake which we covered in a separate video HERE.

Also on the Monday we heard from Shlomit Weiss, Senior VP and General Manager of Design engineering who touched on the subject of Intel's fabrication processes and IDM 2.0 which Matthew ran in a news piece about the event HERE.

On the Tuesday we headed up to Haifa to the IDC (Israel Development Centre) where we saw all manner of automated testing stations that were hard at work on Raptor Lake. We were forbidden to take cameras into the test labs however we sat down for a conversation with Marcus Kennedy, General Manager of the Gaming, Creator and Esports Segment in the Client Computing Group at Intel Corporation, which you can check out HERE.

Our final port of call was Fab 28 at Kiryat Gat on the Wednesday. Once we were inside we were unable to take photos or video however we were able to get some snaps outside of the enormous Fab 38 that is being built next door to Fab 28. In our video you will see a load of B-roll of wafers moving around the Fab as they are transformed from sand into Raptor Lake CPUs.

KitGuru says: Intel 13th Gen Raptor Lake will follow hard on the heels of AMD Zen 4 Ryzen 7000 and we predict a pitched battle between these new gaming CPUs.

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Intel wants to use EUV lithography for 7nm process technology https://www.kitguru.net/components/cpu/anton-shilov/intel-wants-to-use-euv-lithography-for-7nm-process-technology/ https://www.kitguru.net/components/cpu/anton-shilov/intel-wants-to-use-euv-lithography-for-7nm-process-technology/#comments Thu, 16 Jul 2015 20:48:21 +0000 http://www.kitguru.net/?p=259382 Intel Corp. has implied a number of times that it did not need to use extreme ultraviolet lithography for its 7nm manufacturing process. However, after facing problems with multi-patterning methods at 14nm and 10nm fabrication technologies, it seems that the company has changed its mind. This week Intel said that it is exploring possibilities to …

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Intel Corp. has implied a number of times that it did not need to use extreme ultraviolet lithography for its 7nm manufacturing process. However, after facing problems with multi-patterning methods at 14nm and 10nm fabrication technologies, it seems that the company has changed its mind. This week Intel said that it is exploring possibilities to use EUV at 7nm. Unfortunately, it is still unclear whether appropriate tools will be ready by the time Intel needs them.

“At 7nm, we are trying to bring in EUV,” said Stacy Smith, chief financial officer of Intel, during the company’s quarterly conference call with investors and financial analysts. “Depending on the health of that [technology], we could be at two years, we could be at 2.5 years [with 10nm fabrication process].”

Extreme ultraviolet lithography is an advanced patterning technology that allows semiconductor makers to keep scaling down feature sizes of chips. Thanks to 13.5nm wavelength of EUV lasers, it will be possible to “draw” finer elements of chips without using difficult multiple-patterning techniques and implementing additional metal layers that complicate manufacturing technology and make it more expensive. EUV is also expected to bring significant benefits in terms of yield and cycle time.

intel_ireland_semiconductor_chip_fab_300mm_wafer_2

Intel has been using various forms of multiple-patterning, a semiconductor manufacturing technology that allows to enhance feature density by drawing multiple lines on the same photoresist layer using different photomasks, since its 65nm process technology. While in general usage of multi-patterning has not been a problem for Intel, things got very complicated at 14nm, when the number of mask steps increased. In a bid to ensure that it can produce chips using 10nm fabrication technology with high yields and in high volume, Intel decided to postpone the roll-out of appropriate chips by one year to tune the manufacturing process and its designs. Some believe that Intel plans to use quintuple-patterning for its 10nm tech, which is extremely complex and expensive.

Because of extreme difficulties it faces with modern process technologies, Intel indicated that from now on it will produce three generations of chips using the same process technology instead of two. The company said that it would like to get back to two-year cycle time and that it could be possible with EUV lithography.

intel_fab32_foup_semiconductor

While EUV scanners have existed for years, their productivity is too low for commercial production. Experimental ASML NXE:3300B EUV scanners are capable of processing 500 wafers per 24 hours. However, for high-volume manufacturing wafer scanners should process 1500+ wafers per 24 hours. It is still unclear when EUV scanners from ASML be able to hit necessary production capabilities.

“We will take a look at what is the maturity of EUV, what is the maturity of the material science changes that are occurring, what is the complexity of the product roadmap that we are adding, and make that [cycle-related] adjustment in the future,” said Brian Krzanich, chief executive officer of Intel.

Discuss on our Facebook page, HERE.

KitGuru Says: Since it is believed that Intel has ordered 15 EUV scanners from ASML earlier this year, it looks like there is a plan to start using EUV at 7nm several years after 10nm introduction in 2017. Depending on capabilities of the tools, Intel may start making 7nm chips in 2019 or 2020.

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Intel’s ‘Kaby Lake’ processors will be released in late 2016 – report https://www.kitguru.net/components/cpu/anton-shilov/intels-kaby-lake-processors-will-be-released-in-late-2016-report/ https://www.kitguru.net/components/cpu/anton-shilov/intels-kaby-lake-processors-will-be-released-in-late-2016-report/#comments Tue, 07 Jul 2015 20:52:48 +0000 http://www.kitguru.net/?p=257908 Intel Corp.’s “Kaby Lake” central processing units will be released exactly a year after the company’s “Skylake” chips due this August and September. The introduction of chips in late third quarter means that the company will further postpone the roll-out of microprocessors made using 10nm fabrication process. As reported, Intel’s “Kaby Lake” processors will replace …

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Intel Corp.’s “Kaby Lake” central processing units will be released exactly a year after the company’s “Skylake” chips due this August and September. The introduction of chips in late third quarter means that the company will further postpone the roll-out of microprocessors made using 10nm fabrication process.

As reported, Intel’s “Kaby Lake” processors will replace the company’s “Cannon Lake” central processing units next year and will succeed its “Skylake” products. The chips will be build using 14nm manufacturing technology and will likely resemble “Skylake” both in terms of design and in terms of micro-architecture. It is unknown whether the new CPUs will support any new instructions, such as AVX-512 (AVX 3.2) or any other significant improvements.

Earlier it was believed that the “Kaby Lake” was a temporary solution in order to refresh Intel’s product lineup before all-new 10nm “Cannonlake” chips hit the market, which is something that happened to “Broadwell”. It now appears that the “Kaby Lake” is a product family that will be Intel’s primary product lineup for a long time, according to DigiTimes. The report claims that Intel will start to roll-out the consumer versions of “Kaby Lake” chips in September, 2016, and will conclude the roll-out with high-end enterprise-class “Kaby Lake” processors in early 2017. Such launch schedule indicates that the world’s No. 1 maker of microprocessors will not release its 10nm chips until sometimes in 2017.

intel_core_pentium_devil_s_canyon_lga1150_haswell

Based on what is currently known about the new microprocessors, “Kaby Lake” chips feature two or four cores, a new generation integrated graphics engine, a dual-channel memory controller and up to 256MB of on-package cache to speed-up graphics workloads. Intel’s “Kaby Lake” processors for desktops will retain LGA1151 form-factor and will be drop-in compatible with “Skylake” infrastructure and motherboards powered by Intel’s 100-series chipsets.

Different versions of “Kaby Lake” processors – “Kaby Lake-S”, “Kaby Lake-H”, “Kaby Lake-U” and “Kaby Lake-Y” – will address various segments of the market, including mobile and desktop clients. The CPUs will have thermal design power ranging from 4.5W to 91W.

Intel did not comment on the news-story.

Discuss on our Facebook page, HERE.

KitGuru Says: Looks like Intel’s “tick-tock” model, where “tick” represents a die shrink and a new process technology, whereas “tock” represents a new microarchitecture, got broken. With “Haswell”, “Hawell Refresh”, “Broadwell”, “Skylake” and “Kaby Lake” it now more resembles something like “tock-tock-tick-tock-tock”. Keeping in mind that a modern process technology costs $1.5 billion to develop, whereas a new leading-edge fab can cost $6 – $7 billion to build, it is not surprising that even Intel is not as aggressive as it used to be with its transitions. However, the real question is not whether Intel retains its process technology leadership at 10nm and/or beyond. The real question is whether companies like Samsung Electronics or Taiwan Semiconductor Manufacturing Co. can convert their manufacturing technology advantages into real-world benefits for products they produce for their clients.

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Intel delays ramp of 10nm mass production due to poor yields – report https://www.kitguru.net/components/anton-shilov/intel-delays-ramp-of-10nm-mass-production-due-to-poor-yields-report/ https://www.kitguru.net/components/anton-shilov/intel-delays-ramp-of-10nm-mass-production-due-to-poor-yields-report/#comments Thu, 25 Jun 2015 11:08:21 +0000 http://www.kitguru.net/?p=256084 Intel Corp. has again delayed installation of equipment necessary to produce semiconductors in high volume using 10nm process technology. It is believed that Intel experiences yield ramp issues, just like in case of its 14nm manufacturing tech, which is why it does not make sense for the company to buy and install new equipment just …

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Intel Corp. has again delayed installation of equipment necessary to produce semiconductors in high volume using 10nm process technology. It is believed that Intel experiences yield ramp issues, just like in case of its 14nm manufacturing tech, which is why it does not make sense for the company to buy and install new equipment just now.

In April, it was reported that Intel put off purchase of tools to start mass production of chips at fab 28 in Kiryat Gat, Israel, from March to December. The acquisition of the equipment is a part of a $6 billion upgrade plan for the company’s semiconductor fabrication facility, which is tremendously important for Intel. SemiWiki reports that recently the world’s largest chipmaker decided to further delay purchase of the equipment to 2016 and hence postpone volume production of chips using its 10nm fabrication process.

intel_wafer_300mm_semiconductor

Intel’s competitors on the market of semiconductors – Samsung Electronics and Taiwan Semiconductor Manufacturing Co. – plan to start high-volume production of 10nm products in 2015. Potentially, they may leave Intel behind with the new node, which is a bad news for Intel, which has been the technological leader of the semiconductor market for decades.

If Samsung and TSMC manage to start high-volume production of 10nm chips earlier than Intel and those processors can threat central processing units from Intel, then the latter is in trouble. At present Intel has to sell its tablet system-on-chips at a loss in order to sustain or gain market share against partners of ARM Holdings. If designers of ARM-based chips gain technological advantage over Intel and that advantage translates into performance and power consumption benefits, then Intel is in trouble since notebook designers may prefer ARM-based SoCs to Intel’s CPUs.

One thing that should be kept in mind is that Intel’s manufacturing processes are usually superior when compared to fabrication technologies by other makers of semiconductors. Newer manufacturing technologies from Intel have always featured smaller transistor fin pitch, transistor gate pitch as well as interconnection pitch than predecessors in a bid to maximize transistor density. By contrast, Intel’s rivals make trade-offs that reduce transistor density and increase per-transistor costs, which makes it harder for their customers to use those technologies. Moreover, some experts believe that Intel may introduce a new transistor structure at 10nm, improving performance and reducing power consumption of its chips. By contrast, Samsung and TSMC will continue to use FinFET transistors at 10nm. That said, it is not cast in stone that Samsung’s and TSMC’s 10nm technologies will be dramatically better than Intel’s 14nm FinFET.

intel_semiconductor_reduction_cost_chip_manufacturing

Back in May, the world’s largest maker of microprocessors promised to disclose details about its 10nm plans later this year.

Intel did not comment on the news-story.

Discuss on our Facebook page, HERE.

KitGuru Says: Given the recent unofficial information about the delay of 10nm “Cannonlake” and introduction of 14nm “Kaby Lake” processor in 2016, it is obvious that the company is slowing down its pace to 10nm. The only question is whether Intel is trying to reduce its spending to keep financial analysts happy, has technological problems it cannot resolve quickly or is just trying to develop absolutely the best 10nm process not only for its microprocessors and SoCs, but also for its foundry customers, such as Altera.

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Intel: We will reveal schedule for 10nm chips later this year https://www.kitguru.net/components/cpu/anton-shilov/intel-we-will-reveal-schedule-for-10nm-chips-later-this-year/ https://www.kitguru.net/components/cpu/anton-shilov/intel-we-will-reveal-schedule-for-10nm-chips-later-this-year/#respond Fri, 22 May 2015 22:57:14 +0000 http://www.kitguru.net/?p=250811 Intel Corp. has been particularly tight-lipped about its roadmap concerning microprocessors to be made using 10nm fabrication process. However, on Friday the company said that development of the 10nm technology is progressing well and it will share more information about products it plans to produce using the process later this year. “The 10nm development is progressing very …

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Intel Corp. has been particularly tight-lipped about its roadmap concerning microprocessors to be made using 10nm fabrication process. However, on Friday the company said that development of the 10nm technology is progressing well and it will share more information about products it plans to produce using the process later this year.

“The 10nm development is progressing very well,” said Renee James, president of Intel, during a Q&A session with stockholders at the company’s annual meeting. “You will start to see start-up cost in the second half of the year on 10nm. We will talk about the timing of [10nm] later this year – the early part of next year about when that will happen.

Intel has not disclosed almost anything regarding its 10nm manufacturing process so far. The only thing that is known about Intel's 10nm fabrication tech is that the chip giant wants to further increase transistor density and reduce per transistor cost, something that many contract makers of semiconductors have failed to do with their 14nm/16nm FinFET processes. Unfortunately, the most recent reports about Intel’s 10nm chips and production of microprocessors using the node contradicted each other.

intel_semiconductor_intel_custom_foundry_alley-with-worker-in-fab-16x9

In April, it was reported that Intel postponed purchase of equipment needed to start mass production of chips at fab 28 in Kiryat Gat, Israel, from March to December. The purchase of the equipment is a part of a $6 billion upgrade plan for fab 28, which is crucial for Intel. The delay could potentially set back volume production of chips made using 10nm fabrication process.

In May, a leaked slide from Intel’s roadmap revealed the company’s plans to start commercial shipments of its “Cannonlake” processors for mobile devices in mid-2016, which means that production should begin at least three months before commercial shipments (i.e., early in 2016).

intel_semiconductor_reduction_cost_chip_manufacturing

At present Intel Intel is setting up a pilot line for 10nm production in D1X development fab in Hillsboro, Oregon. The line will be operational shortly from now and will allow Intel to learn maximum amount of information about its new process technology and designs (i.e., “Cannonlake”, “Knights Hill”, etc.). Once Intel learns enough about its tech and products, it can start to transfer the technology to different fabs (i.e., fab 28 in case of 10nm), a process called Copy Exactly. The “Copy Exactly” methodology requires matching equipment configuration, chemical purity and a lot of other things. Intel does not start the CE process before manufacturing technology hits multiple targets, such as yield, performance and other. The parameters at all factories are then monitored and adjusted on-the-fly in a bid to improve yields, performance characteristics, etc. simultaneously at all Intel's fabs across the globe.

Process technology development and finalization take a long time, just like the Copy Exactly process. If Intel moves in new equipment to fab 28 only in late 2015, it will not be able to mass produce 10nm chips in early Q2 2016.

intel_wafer_300mm_semiconductor

It is highly likely that Intel will reveal more details about its 10nm process technology at plans at the upcoming Intel Developer Forum trade-show in mid-August.

Discuss on our Facebook page, HERE.

KitGuru Says: If Intel is ready to talk about its 10nm manufacturing technology, it generally means that the chip giant is satisfied with its fabrication process and is confident that products made using it will hit all necessary parameters on time.

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Intel: 10nm and 7nm technologies have perfect economic feasibility https://www.kitguru.net/components/cpu/anton-shilov/intel-10nm-and-7nm-technologies-have-perfect-economic-feasibility/ https://www.kitguru.net/components/cpu/anton-shilov/intel-10nm-and-7nm-technologies-have-perfect-economic-feasibility/#comments Wed, 15 Apr 2015 13:02:03 +0000 http://www.kitguru.net/?p=245233 It is not a secret that transitions to newer chip manufacturing processes are getting more difficult from financial capital standpoint since not only research and development costs more than before, but also production equipment is getting more expensive. In a bid to keep their prices at current levels, semiconductor companies need to increase transistor densities of …

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It is not a secret that transitions to newer chip manufacturing processes are getting more difficult from financial capital standpoint since not only research and development costs more than before, but also production equipment is getting more expensive. In a bid to keep their prices at current levels, semiconductor companies need to increase transistor densities of their process technologies at a pace faster than Moore’s law. Intel believes that it can do this at 7nm and 10nm.

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According to some estimates, it costs $1.3 – $1.5 billion to create a new manufacturing process from scratch nowadays, which involves a lot of fundamental research as well as development of new materials. In addition, large makers of semiconductors sometimes also participate in development of production equipment. Once fabrication technology is developed, manufacturers need to equip their fab(s) with new tools or even build new a new fab. As a result, it requires tremendous amount of capital to start making new chips using a new process technology.

“Capital intensity is going to go up as measured by capital cost per square inch of silicon,” said Stacy Smith, chief financial officer of Intel, during the company’s quarterly conference call with investors and financial analysts.

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That capital cost is a headache for all makers of chips because if it is too high, they either need to lower their margins or increase their prices. To offset increases of capital costs per square millimeter of a chip, makers of semiconductors need to increase transistor densitires, which is not an easy task due to leakages and other effects. However, Intel claims that it has found ways to increase those densities going forward, which will make its 7nm and 10nm process technologies economically feasible.

intel_semiconductor_reduction_cost_chip_manufacturing_by_wafer_starts

“We believe that through 14nm, 10nm and with some insight all the way down the 7nm we can offset that increase in capital cost per square inch of silicon by improving our density,” said Mr. Smith. “So we can keep the cost per transistor coming down at the historical curve.”

intel_semiconductor_reduction_cost_chip_manufacturing_by_die_size

Increasing transistor density helps Intel to reduce die sizes of its chips without decreasing their performance or feature-set. For example, Intel's dual-core “Broadwell” processor is 37 per cent smaller than comparable “Haswell” chip, but its feature sizes are 33 per cent smaller, which is a good example how transistor density increases from generation to generation. As a result, increase of transistor density is a crucially important thing for the company in the future.

“We believe [that on] the 10nm [node] the capital per wafer start does go up, but it goes up less than the density does,” said Brian Krzanich, chief executive officer of Intel. He added that the company’s 10nm unit costs and per-transistor costs will offset increased capital requirements.

intel_semiconductor_reduction_cost_chip_manufacturing_haswell_vs_broadwell

Discuss on our Facebook page, HERE.

KitGuru Says: Keeping in mind that Intel controls architecture, design, technology and manufacturing aspects of its business, the company has a lot of flexibility. In general, Intel can make almost any reasonably good manufacturing process economically feasible for itself. Still, the chip giant has to solve numerous fundamental technology-related challenges, such as materials, leakage and so on.

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Intel is quietly delaying 10nm production – report https://www.kitguru.net/components/cpu/anton-shilov/intel-is-quietly-delaying-10nm-production-report/ https://www.kitguru.net/components/cpu/anton-shilov/intel-is-quietly-delaying-10nm-production-report/#comments Tue, 14 Apr 2015 01:01:22 +0000 http://www.kitguru.net/?p=244924 Intel Corp. delayed mass production of 14nm chips by nearly a year because of insufficient yields. According to a media report, something similar may happen to its 10nm manufacturing technology. Intel is setting up a small pilot line for 10nm production in D1X development fab in Hillsboro, Oregon, reports SemiconductorEngineering. Volume production of chips using …

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Intel Corp. delayed mass production of 14nm chips by nearly a year because of insufficient yields. According to a media report, something similar may happen to its 10nm manufacturing technology.

Intel is setting up a small pilot line for 10nm production in D1X development fab in Hillsboro, Oregon, reports SemiconductorEngineering. Volume production of chips using 10nm process technology is expected to start at fab 28 in Kiryat Gat, Israel. As a part of its plans to spend $6 billion on fab 28 upgrades, Intel was expected to make fab tool purchases for high-volume manufacturing at 10nm in March. However, it is now reported that those acquisitions will not happen until December of this year, which could potentially delay volume production of chips using 10nm fabrication process.

intel_ireland_semiconductor_chip_fab_300mm_wafer_2

Officially, Intel does not disclose exact plans regarding 10nm manufacturing technology, but it is highly likely that the first products made using the tech will be available in 2017.

“We have not disclosed a schedule for our 10nm process and we won’t engage in speculation about it.”

Previously it was expected that Intel will roll-out its 10nm chips in early 2017. But if the company significantly delays mass production, actual products will emerge only in late 2017. Intel will use 10nm process tech to make its code-named “Cannonlake” processors.

Discuss on our Facebook page, HERE.

KitGuru Says: It is not surprising that transitions to newer process technologies are getting harder for manufacturers. What remains to be seen is whether Intel will drop its “tick – tock” strategy and will use one process tech to make more than two generations of its chips.

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Intel to spend $6 billion on 10nm fab in Israel https://www.kitguru.net/components/cpu/anton-shilov/intel-to-spend-6-billion-on-10nm-fab-in-israel/ https://www.kitguru.net/components/cpu/anton-shilov/intel-to-spend-6-billion-on-10nm-fab-in-israel/#comments Tue, 23 Sep 2014 22:59:32 +0000 http://www.kitguru.net/?p=213245 The Israeli government announced this week that it has approved a plan submitted by Intel Corp. regarding upgrading its fab in Kiryat Gat. Under the terms of the plan the chip giant intends to significantly modernize its semiconductor manufacturing facility in order to build chips using 10nm process technology there. Intel plans to spend as much …

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The Israeli government announced this week that it has approved a plan submitted by Intel Corp. regarding upgrading its fab in Kiryat Gat. Under the terms of the plan the chip giant intends to significantly modernize its semiconductor manufacturing facility in order to build chips using 10nm process technology there.

Intel plans to spend as much as $6 billion (€4.67 billion, £3.66) on the upgrades necessary to make chips using the forthcoming 10nm process technology in Kiryat Gat. The government of Israel will grant Intel $300 million over five years in subsidies and the world’s largest chip designer will be eligible to pay a corporate tax rate of only 5 per cent for a 10-year period, reports Reuters news-agency.

“Intel's investment is a strategic asset for Israel's industry,” said Yair Lapid, the finance minister of Israel. “This is the biggest investment by a foreign company ever in Israel and is further proof that Israel is at the forefront of technology and innovation.”

intel_ireland_semiconductor_chip_fab_300mm_wafer_2

At present Intel’s fab 28 in Kiryat Gat produces various products using 32nm process technology.

The chip giant is expected to make the official announcements regarding the upgrade of the fab in the coming days.

Discuss on our Facebook page, HERE.

KitGuru Says: The fact that Intel has made the decision to invest in Fab 28 indicates that the company is more confident about the future than it was earlier this year, when it announced delays in deployments of new fabs in the U.S.

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