Intel Core M | KitGuru https://www.kitguru.net KitGuru.net - Tech News | Hardware News | Hardware Reviews | IOS | Mobile | Gaming | Graphics Cards Wed, 02 Sep 2015 11:45:04 +0000 en-US hourly 1 https://wordpress.org/?v=6.4.3 https://www.kitguru.net/wp-content/uploads/2021/06/cropped-KITGURU-Light-Background-SQUARE2-32x32.png Intel Core M | KitGuru https://www.kitguru.net 32 32 Intel: ‘Skylake’ to have 10–20% higher performance than ‘Broadwell’ https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-expects-skylake-to-have-10-20-higher-performance-than-broadwell/ https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-expects-skylake-to-have-10-20-higher-performance-than-broadwell/#comments Fri, 24 Jul 2015 11:04:01 +0000 http://www.kitguru.net/?p=260610 It is not a secret that Intel Corp.’s upcoming “Skylake” processors will have a number of micro-architecture-related advantages over predecessors. Various leaks point to different kind of performance gains, but Intel itself, apparently, expects its new central processing units to be 10 – 20% faster than “Broadwell” products depending on application. FanlessTech has published what …

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It is not a secret that Intel Corp.’s upcoming “Skylake” processors will have a number of micro-architecture-related advantages over predecessors. Various leaks point to different kind of performance gains, but Intel itself, apparently, expects its new central processing units to be 10 – 20% faster than “Broadwell” products depending on application.

FanlessTech has published what looks like an official Intel “Skylake” platform overview for system makers and resellers. The document explains basic advantages the new central processing units and supporting platforms have over predecessors as well as give some additional understanding regarding technologies that are integrated into new desktop and notebook platforms from Intel.

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One of Intel’s slide promises that the new processors based on the “Skylake” micro-architecture will offer 10 – 20 per cent higher performance in single-thread and multi-thread workloads compared to chips featuring “Broadwell” technology. Desktop CPUs are expected to be around 11 per cent faster than predecessors thanks to new micro-architecture, whereas ultra-low-power Core M mobile chips are projected to be 17 per cent faster than current-gen Core M offerings thanks to a combination of architectural and clock-rate advancements.

The upcoming “Skylake” processors will also feature Intel’s ninth-generation integrated graphics core (Intel Gen 9 LP) with a number of architectural enhancements as well as increased amount of execution units. The new integrated graphics adapter from Intel is expected to provide 16 – 41 per cent performance improvement over Gen 8 cores in 3DMark 11, according to an Intel’s slide.

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Thanks to architectural advantages of microprocessors, new core-logic sets and a number of other improvements, mobile computers featuring “Skylake chips are also expected to have longer battery life than existing notebooks. Intel claims that certain “Skylake”-based hybrid PCs will be able to offer up to 11.3 hours of full-HD video playback on one charge.

Next-generation Intel Core M processors with integrated core-logic will finally offer tablet-focused input/output technologies, such as eMMC 5.0, SD XC 3.0, CSI2, USB OTG and so on. Previously makers of tablets and hybrids had to rely on PC interfaces when building their products with Core M inside, which compromised dimensions, battery life and features. Thanks to “Skylake-Y” chips, high-performance Intel-based tablets will now look and perform exactly like other slates featuring ARM-based system-on-chips.

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Select mobile computers with new CPUs will also feature Rezence wireless charging, WiGig wireless docking capabilities as well as 4G/LTE cat. 6 modem. Systems powered by “Skylake” chips will also have a number of improvements when it comes to audio processing, 3D camera, touchscreen responsiveness, security and so on.

Intel plans to introduce enthusiast-class “Skylake” processors for desktops in early August, 2015. Mobile PCs featuring the new chips will hit the market in September – October timeframe.

Intel did not comment on the news-story.

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KitGuru Says: Intel’s “Skylake” platform is nothing but impressive, especially when it comes to mobile computing. However, it remains to be seen whether PC makers will actually release bold and innovative systems that take advantage of everything the new silicon from Intel has to offer.

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Notebook makers need to adjust inventory before releasing ‘Skylake’ laptops – report https://www.kitguru.net/desktop-pc/anton-shilov/notebook-makers-need-to-adjust-inventory-before-releasing-skylake-laptops-report/ https://www.kitguru.net/desktop-pc/anton-shilov/notebook-makers-need-to-adjust-inventory-before-releasing-skylake-laptops-report/#comments Thu, 23 Jul 2015 22:45:38 +0000 http://www.kitguru.net/?p=260547 It is not a secret that Intel Corp. plans to formally introduce its code-named “Skylake” processors for mobile computers in late September or early October, 2015. Apparently, notebook makers are ready to mass produce new generation of laptops based on the next-gen central processing units, according to a media report. However, many vendors still need …

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It is not a secret that Intel Corp. plans to formally introduce its code-named “Skylake” processors for mobile computers in late September or early October, 2015. Apparently, notebook makers are ready to mass produce new generation of laptops based on the next-gen central processing units, according to a media report. However, many vendors still need to clear-out their current inventory before releasing next-gen products.

The mobile PC supply chain has already prepared to start mass-production of “Skylake”-based notebooks in September, reports DigiTimes. However, since many laptop brands still have a lot of current-generation notebooks in the channel inventory, they need to sell them off first and only then start to roll-out their next-gen products. In fact, according to the web-site, notebook suppliers are “adjusting” their schedules for launches of “Skylake”-based products to minimize the impact.

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The report claims that Hewlett-Packard is “currently ahead of others in the preparation”, which means that the company may introduce the broadest range of “Skylake”-based laptops among top PC makers. While leading manufacturers of mobile personal computers will likely introduce their flagship offerings featuring “Skylake” central processing units in September or October, mainstream laptops will get “Skylake” chips a little later.

Last year Intel said that notebooks powered by its “Skylake” processors will have a number of distinctive features compared to currently available machines. In particular, such laptops are expected to feature Rezence wireless charging capability (WiTricity), WiGig wireless docking technology, USB 3.1 with type-C receptacle and numerous other innovative capabilities.

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Laptop makers reportedly do not expect Microsoft Windows 10 to be a major demand driver for their products. However, keeping in mind that “Skylake” chips will be released after Windows 10 hits the market, all “Skylake”-based notebooks will run the new OS from Microsoft.

Intel did not comment on the news-story.

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KitGuru Says: While flagship “Skylake”-based notebooks will clearly integrate Rezence, WiGig, USB 3.1 and other innovations, it remains to be seen whether mainstream notebooks will sport such technologies too. In a bid to significantly boost their sales, Intel and its partners will need to create “Centrino” effect with new platforms. Unfortunately, at present there are no signs that Intel is preparing a massive product launch, but rather is getting ready for a refresh.

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ECS unveils tiny Liva Core PCs with Intel Core M inside https://www.kitguru.net/desktop-pc/anton-shilov/ecs-unveils-tiny-liva-pcs-with-intel-core-m-inside/ https://www.kitguru.net/desktop-pc/anton-shilov/ecs-unveils-tiny-liva-pcs-with-intel-core-m-inside/#respond Tue, 02 Jun 2015 06:50:26 +0000 http://www.kitguru.net/?p=252226 Elitegroup Computer Systems has introduced one of the world’s first desktop personal computers with Intel Corp.’s Core M processor inside. The new system is very tiny and is completely silent, but it has features similar to those supported by full-size desktops. The new Liva Core personal computer is based on the Intel Core M-5Y10C “Broadwell” …

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Elitegroup Computer Systems has introduced one of the world’s first desktop personal computers with Intel Corp.’s Core M processor inside. The new system is very tiny and is completely silent, but it has features similar to those supported by full-size desktops.

The new Liva Core personal computer is based on the Intel Core M-5Y10C “Broadwell” system on-chip with two cores and built-in Intel HD Graphics 5300. The microprocessor has thermal design power of 4.5W and can be cooled down using only a radiator, which means that the system is absolutely silent. The SoC hardly provides high performance, but those who need minimal size and absolute silence will hardly find anything that provides truly high performance.

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The ECS Liva Core is equipped with 4GB DDR3L memory, one Intel M.2 solid-state drive, 802.11ac WiFi card, four USB 3.0 ports, micro SD card reader, Gigabit Ethernet port and so on. The computer supports Intel Wireless Display technology in addition to two HDMI outputs. The tiny PC has 136mm*84mm*38mm dimensions.

KitGuru’s Leo Waldock has pictured the ECS Liva Core at Computex in Taipei, Taiwan. The system should hit the market shortly from now. The tiny desktop PC will ship with Windows 8.1, but it is ready for Windows 10 that will be available later this year as a free upgrade to owners of Windows 8.1.

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Pricing of ECS Liva Core is unclear, but do not expect it to be too affordable: Intel Core M processors are rather expensive and small form-factor PCs are not cheap in general.

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KitGuru Says: Usage of mobile SoCs inside SFF desktops is an interesting decision. On the one hand, it allows companies to build ultra-small PCs that are also silent. On the other hand, such PCs are too expensive for the mass market and will hardly become popular, especially keeping in mind that Core M processors do not offer truly high performance.

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Apple announces new 12 inch Macbook with Retina display https://www.kitguru.net/lifestyle/mobile/apple/matthew-wilson/apple-announces-new-12-inch-macbook-with-retina-display/ https://www.kitguru.net/lifestyle/mobile/apple/matthew-wilson/apple-announces-new-12-inch-macbook-with-retina-display/#comments Mon, 09 Mar 2015 19:27:40 +0000 http://www.kitguru.net/?p=239307 Apple has officially announced the 12 inch Macbook Air with Retina display, proving some of the key early rumors true. The new Macbook is the lightest of the lot, weighing in at just 2lb and measuring in at just 13.1mm at its thickest point. As previously speculated, the new Macbook Air will come in a …

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Apple has officially announced the 12 inch Macbook Air with Retina display, proving some of the key early rumors true. The new Macbook is the lightest of the lot, weighing in at just 2lb and measuring in at just 13.1mm at its thickest point.

As previously speculated, the new Macbook Air will come in a completely fanless design thanks to the new Intel Core M chip, meaning that it will operate silently according to Apple. The chip is embedded on Apple's smallest logic board ever, freeing up extra room in the chassis for layered batteries to power the new high-resolution display.

Macbook Air

There is a newly redesigned keyboard based on a new butterfly switch, making typing more precise and accurate. This is accompanied by the new trackpad, made of a glass multi-touch surface, using a new haptic feedback system for touch recognition, the same system will be found on the Apple Watch.

The device will feature just one USB Type-C connector, just as earlier rumors suggested. Other specifications include 802.11ac wireless, 8GB of RAM, a 256GB SSD and Bluetooth 4.0 support. The new Macbook will come in Space Grey, Gold and the more traditional silver. It will launch on the 10th of April at £1049 while the higher spec model will cost £1299.

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KitGuru Says: The new Macbook Air features some fairly radical design changes, most notably, the removal of all ports aside from one USB Type-C connector. The 12 inch form factor is also pretty uncommon. 

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HP’s EliteBook 1020 is thinner, more powerful than Apple MacBook Air https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/hps-elitebook-1020-is-thinner-more-powerful-than-apple-macbook-air/ https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/hps-elitebook-1020-is-thinner-more-powerful-than-apple-macbook-air/#comments Tue, 02 Dec 2014 23:59:06 +0000 http://www.kitguru.net/?p=224532 Hewlett Packard on Tuesday introduced its new family of laptops that includes notebooks, which are thinner and more powerful than Apple’s MacBook Air, a laptop that is considered as a de-facto standard for ultra-thin laptops. At present it is unknown how much will the new laptops cost, but since the systems are positioned for enterprise …

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Hewlett Packard on Tuesday introduced its new family of laptops that includes notebooks, which are thinner and more powerful than Apple’s MacBook Air, a laptop that is considered as a de-facto standard for ultra-thin laptops. At present it is unknown how much will the new laptops cost, but since the systems are positioned for enterprise users, do not expect them to be affordable.

The new HP EliteBook Folio 1020 laptops feature 12.5” displays with 2560*1440 resolution, a significant improvement compared to competing ultra-thin notebooks. The HP EliteBook 1020 and the HP EliteBook Folio 1020 Special Edition (SE) laptops are only 15.7mm thick, which is thinner than 17mm MacBook Air. The HP EliteBook 1020 SE is made of HP's blend of magnesium-lithium alloy and carbon fiber to achieve a weight of only 1 kg (2.2 lbs.).

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The new ultra-thin laptops from HP are based on Intel Core M “Broadwell” processors with two or four x86 cores and new-generation integrated graphics. The notebooks are equipped with DDR3 memory, low-power solid-state drives, vPro and TPM technologies for maximum security, 802.11ac Wi-Fi, Bluetooth 4.0, fingerprint reader, 720p webcam, advanced audio sub-system with DTS logo and so on.

“The HP EliteBook1020 represents game-changing innovation in both materials and mechanical engineering to create the world's thinnest and lightest business notebooks in a form factor that enables our customers to be more productive in more places,” said Alex Cho, vice president and general manager, HP Commercial PCs. “Customers demand not only a stylish, thin and light notebook, but also a device that delivers advanced security and can withstand the rigorous demands that come with a highly mobile lifestyle – and the HP EliteBook 1020 delivers this complete solution.”

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While at present the EliteBook Folio 1020 laptops may be considered as the world’s thinnest, it should be noted that Apple is also working on its new 12.5” MacBook Air notebooks that are expected to be thinner than existing models. As a result, HP’s new business-class mobile PCs may not be the world’s thinnest laptops when they actually become available.

The HP EliteBook Folio 1020 Standard Edition will be available in February, whereas the HP EliteBook Folio 1020 Special Edition is expected to hit the market in April.

Discuss on our Facebook page, HERE.

KitGuru Says: It is completely unclear why HP decided to position its new EliteBook Folio 1020 laptops solely for corporate users. Positioning of the systems will make them pretty expensive, as a result, the new notebooks have no chances to become as popular as Apple’s MacBook Air PCs, which start at $899/£749.

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Intel Core M processors to power 5% – 10% of notebooks next year – report https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-core-m-processors-to-power-5-10-of-notebooks-next-year-report/ https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-core-m-processors-to-power-5-10-of-notebooks-next-year-report/#comments Thu, 06 Nov 2014 23:43:00 +0000 http://www.kitguru.net/?p=220745 Intel Corp.’s Core M microprocessors boast impressively low power consumption and heat dissipation, which will enable new types of low-power/ultra-thin personal computers. Unfortunately, due to limited performance provided by the Core M chips, their adoption will be limited too, according to a media report. Only around 5 – 10 per cent of most notebook vendors’ …

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Intel Corp.’s Core M microprocessors boast impressively low power consumption and heat dissipation, which will enable new types of low-power/ultra-thin personal computers. Unfortunately, due to limited performance provided by the Core M chips, their adoption will be limited too, according to a media report.

Only around 5 – 10 per cent of most notebook vendors’ shipments in 2015 will be based on the Core M processors powered by the code-named “Broadwell” or “Skylake” micro-architectures, reports DigiTimes web-site. Intel’s Core M chips with 4.5W power consumption are good for high-performance tablets, hybrid 2-in-1 systems and certain other low-power/ultra-thin designs. However, given their low clock-rates, they are not competitive on the market of mainstream notebooks, the report claims.

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Intel Core M “Broadwell-Y” system-on-chip

Low impact that the Core M chips will have on the market is a good news for suppliers of discrete graphics processors for mobile PCs – AMD and Nvidia – since the ultra-low-power processors cannot support standalone graphics processing units due to limited number of PCI Express 2.0 lanes. In addition, makers of fans can also be glad: active cooling systems for notebooks will be needed next year.

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Ultra-thin x86-based designs with Intel Core M inside

While market share of Intel’s Core M chips will be limited, the chip giant prepares to release Core i-series “Broadwell-U” system-on-chips with up to 15W thermal design power designed for mainstream notebooks early next-year. The BDW-U SoCs will have considerably higher performance compared to Core M products and will enable ultra-thin fanless notebooks at mainstream price-points. It is unknown whether the “Broadwell-U” microprocessors support standalone GPUs or not. If they do not (which is likely since they are very similar to Core M “Broadwell-Y”), it will be a bad news for AMD, Nvidia and makers of active cooling solutions for laptops (since discrete GPUs need fans).

Intel did not comment on the news-story.

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KitGuru Says: While next year Core M chips with 4.5W power consumption will not meet performance requirements of the mainstream market, it is possible that eventually such chips will gain both performance and market share. While this will naturally boost adoption of various hybrid types of PCs, this will also seriously change the market of mobile computers and components in general.

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Intel quietly expands Core M ‘Broadwell’ family of chips https://www.kitguru.net/components/cpu/anton-shilov/intel-quietly-expands-core-m-broadwell-family-of-chips/ https://www.kitguru.net/components/cpu/anton-shilov/intel-quietly-expands-core-m-broadwell-family-of-chips/#comments Tue, 04 Nov 2014 23:43:47 +0000 http://www.kitguru.net/?p=220292 Intel Corp. has quietly added new Core M “Broadwell” microprocessors into its lineup of chips. The new central processing units consume up to 4.5W of energy and are designed for high-performance tablets, hybrid 2-in-1 systems as well as ultra-thin notebooks. The new CPUs can operate at higher frequencies than their predecessors that have already been …

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Intel Corp. has quietly added new Core M “Broadwell” microprocessors into its lineup of chips. The new central processing units consume up to 4.5W of energy and are designed for high-performance tablets, hybrid 2-in-1 systems as well as ultra-thin notebooks. The new CPUs can operate at higher frequencies than their predecessors that have already been discontinued.

The new Core M 5Y71, 5Y51, 5Y31 and 5Y10C microprocessors belong to the Broadwell-Y (BDW-Y 2+2) breed of system-on-chips that feature microprocessor as well as core-logic set on the same piece of substrate. Just like the Core M chips released in the third quarter, the new Core M SoCs feature two x86 cores with the Hyper-Threading technology, the Intel HD Graphics 5300 core with 24 execution units and various enhancements, 4MB of L3 cache, dual-channel DDR3 memory controller as well as 4.5W thermal design power.

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The new Core M chips feature improved graphics performance thanks to increased clock-rates and higher maximum Turbo Boost frequencies for x86 cores. They should provide higher performance than the first Core M system-on-chips currently used by select makers of tablets and hybrid systems.

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It is logical to expect device manufacturers to quickly transit to newer Core M “Broadwell” processors since they feature higher performance amid similar thermal design power.

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KitGuru Says: While it is good that Intel can increase clock-rates of “Broadwell” processors slightly without boosting their TDPs, the increases are not truly significant. It will be interesting to see the clock-rates of Intel Core “Broadwell-U” SoCs that have 15W thermal design power and are due in early 2015.

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Intel: Hundreds of thousands of wireless recharge stations to be deployed https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-there-will-be-hundreds-of-thousands-wireless-recharge-stations-deployed/ https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-there-will-be-hundreds-of-thousands-wireless-recharge-stations-deployed/#comments Wed, 17 Sep 2014 22:54:31 +0000 http://www.kitguru.net/?p=212299 Earlier this year Intel Corp. announced that reference designs of mobile systems based on its next-generation code-named “Skylake” microprocessors will features Rezence wireless charging technology as well as WiGig ultra-fast wireless interconnection technology. Apparently, the company plans to ensure that not only mobile gadgets feature the new tech, but there is infrastructure to take advantage …

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Earlier this year Intel Corp. announced that reference designs of mobile systems based on its next-generation code-named “Skylake” microprocessors will features Rezence wireless charging technology as well as WiGig ultra-fast wireless interconnection technology. Apparently, the company plans to ensure that not only mobile gadgets feature the new tech, but there is infrastructure to take advantage of the innovations.

After Intel Corp. unveiled its Centrino mobile platform back in 2003, it not only offered PC makers a set of compatible chips and a Wi-Fi solution for notebooks, but it invested in creation of Wi-Fi hotspot infrastructure around the world. The company ensured that Centrino laptops were compatible with wireless hotspots in hotels, restaurants, airports, train stations and other public places. As a result, Wi-Fi became ubiquitous, whereas Centrino became a de-facto standard for business laptops for many years. It looks like something similar is going to happen with Rezence wireless charging standard.

Kirk Skaugen, senior vice president and general manager of the PC client group for Intel, said that the company will also make its best to ensure that there are wireless recharge stations installed in many places by the time products based on the “Skylake” chips emerge on the market.

“We are looking at what options we have there [with Rezence],” said Mr. Skaugen at IDF last week. “In any case we have got a great momentum. We are aligned with Samsung, we are aligned with our competitor Qualcomm. We now have got every major PC maker signed up for the [A4WP group’s Rezence] standard. The question is how much we want to put behind building out the infrastructure. There is nothing to announce today, but what I can tell you is that I think there are going to be hundreds and hundreds of thousands of recharge stations everywhere.”

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Intel demonstrates wireless charging capabilities of a laptop. Image by Cnet News.com

While Intel did not confirm plans to invest hundreds of millions of dollars in wireless charging infrastructure, it is clear that once such infrastructure is in place, people will be more inclined to upgrade to PCs that support the wireless charging technology. Therefore, it is clearly in Intel’s interests to put Rezence into as many places as possible.

Discuss on our Facebook page, HERE.

KitGuru Says: What is unclear is how public places will monetize wireless charging. With Wi-Fi everything is pretty simple, but in case of charging, it will be needed to somehow ask people to pay for putting their gadgets on certain places. It does not sound convenient, does it?

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Intel reveals detailed specifications of Core M ‘Broadwell’ chips https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-reveals-detailed-specifications-of-core-m-broadwell-chips/ https://www.kitguru.net/lifestyle/mobile/laptops/anton-shilov/intel-reveals-detailed-specifications-of-core-m-broadwell-chips/#comments Mon, 08 Sep 2014 22:59:04 +0000 http://www.kitguru.net/?p=210790 Intel Corp. has revealed detailed specifications of the first Core M microprocessors based on the “Broadwell” architecture. While the new processors will clearly not be performance champions, they will consume significantly lower amount of energy compared to existing chips and will enable extremely thin tablets, 2-in-1s and laptops. “We've been on a multi-year mission to …

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Intel Corp. has revealed detailed specifications of the first Core M microprocessors based on the “Broadwell” architecture. While the new processors will clearly not be performance champions, they will consume significantly lower amount of energy compared to existing chips and will enable extremely thin tablets, 2-in-1s and laptops.

“We've been on a multi-year mission to address end-user requirements and transform mobile computing,” said Kirk Skaugen, senior vice president and general manager of personal computing at Intel Corporation. “The introduction of Core M marks a significant milestone in that journey. Core M is the first of a new product family designed to deliver the promise of one of the world's thinnest laptops and highest performance tablets in a single 2 in 1 device.”

The first “Broadwell” processors are Core M 5Y70, 5Y10 and 5Y10A. The chips feature two x86 cores with the Hyper-Threading technology, the Intel HD Graphics 5300 graphics core with 24 execution units and various enhancements, 3MB of L3 cache, dual-channel DDR3 memory controller as well as a core-logic placed on the same piece of substrate as the processor. What is important is that the chips feature 4.5W thermal design power, which is significantly lower compared to TDP's of today’s Core i-series chips. While the new chips are based on high-performance “Broadwell” micro-architecture, their power consumption is even lower than that of Atom processors that use low-power micro-architecture. The new processors are also 50 per cent smaller than their predecessors.

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Image by ComputerBase.de web-site.

At IFA trade-show in Berlin, Germany, manufacturers including Acer, Asustek Computer, Dell, HP, and Lenovo unveiled new, coming-soon Intel Core M processor-based devices across a range of sizes, styles and price points. The first Core M-powered product from Lenovo – the new ThinkPad Helix – will become available already in October.

Discuss on our Facebook page, HERE.

KitGuru Says: While the Broadwell chips will not dliver leading-edge performance initially, they will enable PC makers to build devices not possible before. For example, thin tablets with long battery life, Windows operating and high-performance x86 architecture are now reality.

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Intel to discontinue first Core M ‘Broadwell’ chips ahead of launch https://www.kitguru.net/components/cpu/anton-shilov/intel-to-discontinue-first-core-m-broadwell-chips-ahead-of-launch/ https://www.kitguru.net/components/cpu/anton-shilov/intel-to-discontinue-first-core-m-broadwell-chips-ahead-of-launch/#respond Wed, 03 Sep 2014 22:58:16 +0000 http://www.kitguru.net/?p=210219 Intel Corp.’s Core M “Broadwell” central processing units are already late to market and will be available widely only in 2015. Moreover, the first Core M chips from the “Broadwell” family will be made in very limited quantities since the chipmaker has already issued a document about a plan to discontinue them starting late November, …

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Intel Corp.’s Core M “Broadwell” central processing units are already late to market and will be available widely only in 2015. Moreover, the first Core M chips from the “Broadwell” family will be made in very limited quantities since the chipmaker has already issued a document about a plan to discontinue them starting late November, 2014.

Intel initiated its product discontinuance program for the Core M 5Y70 (1.10GHz), 5Y10 (0.8GHz) and 5Y10A (0.8GHz) microprocessors last week. The last date to order the chips is the 26th of September, 2014. Intel will ship all the aforementioned Core M “Broadwell” central processing units by the 28th of November, 2014.

The world’s largest chipmaker explained in the document that the “market demand for the products have shifted to other Intel products.”

intel_core_m_broadwell_14nm

The Core M 5Y70, 5Y10 and 5Y10A microprocessors belong to the BDW-Y 2+2 breed of the “Broadwell” chips. They feature two x86 cores with the Hyper-Threading technology, the Intel HD Graphics core with 24 execution units and various enhancements, 3MB of L3 cache, dual-channel DDR3 memory controller as well as a core-logic placed on the same piece of substrate as the processor. The Core M (BDW-Y 2+2) chips will have scenario design power of 4.5W – 11.5W and will be used for for 2-in-1s, high-end tablets or ultra-thin laptops.

The very first Core M “Broadwell” chips will feature the E0 stepping of the core. Earlier this year it was reported that the new F-step revision of the “Broadwell” will hit production in November, 2014. Therefore, all the mass “Broadwell” offerings will feature either F (F0) stepping or even a more mature revision.

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KitGuru Says: The situation with the “Broadwell” chips is not very good for Intel. It is obvious that the company has issues with the “Broadwell” design, or the 14nm process technology, or with both. Discontinuing processors before their formal availability is something that Intel has not done for quite a while…

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Intel finds erratum in Haswell and Broadwell chips, disables TSX instructions https://www.kitguru.net/components/cpu/anton-shilov/intel-finds-erratum-in-haswell-and-broadwell-chips-disables-tsx-instructions/ https://www.kitguru.net/components/cpu/anton-shilov/intel-finds-erratum-in-haswell-and-broadwell-chips-disables-tsx-instructions/#comments Wed, 13 Aug 2014 16:49:55 +0000 http://www.kitguru.net/?p=207265 One of the features of Intel Corp.’s Haswell micro-architecture (and Broadwell micro-architecture) were transactional synchronization extensions (TSX), which could significantly boost performance in multi-threaded applications that take advantage of them. As it appears, usage of the technology leads to unpredictable PC behaviour due to an erratum. As a result, Intel this week started to disable …

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One of the features of Intel Corp.’s Haswell micro-architecture (and Broadwell micro-architecture) were transactional synchronization extensions (TSX), which could significantly boost performance in multi-threaded applications that take advantage of them. As it appears, usage of the technology leads to unpredictable PC behaviour due to an erratum. As a result, Intel this week started to disable the tech using a microcode update.

Intel TSX provides a set of instruction set extensions that let software developers to identify regions of code for transactional synchronization. Programmers can use the TSX to achieve the performance of fine-grain locking while actually programming using coarse-grain locks. With transactional synchronization, the hardware can control dynamically whether threads need to serialize through lock-protected critical sections, and perform serialization only when required. This allows the processors to expose and exploit concurrency that would otherwise be hidden due to dynamically unnecessary synchronization. In general, TSX is aimed at server applications and hardly will be needed by consumers.

Unfortunately, the implementation of the TSX in the Haswell, Haswell-E, Haswell-EP and client Broadwell microprocessors contained an error, or erratum, which can cause instabilities. According to Intel, under a complex set of internal timing conditions and system events, software using the TSX instructions may result in unpredictable system behavior.

intel_core_i7_haswell_550

The bug was reportedly discovered by a software developer and caused Intel to disable the technology by updating CPU microcode using  BIOS updates. Intel will let developers to re-enable the TSX in BIOS so to write code for future processors, such as Haswell-EX, Broadwell-EP, Broadwell-EX and other. However, the tech will be disabled for typical users in order to avoid instabilities.

Erratums are often found in multiple microprocessors. Sometimes they cause chipmakers to even recall their products (Intel had to recall the original Pentium chips, whereas AMD had to recall its Opteron “Barcelona” processors in the past), but in many cases certain functions of central processing units just get disabled using a micro-code update.

Intel remains committed to the TSX instructions in the long run, so the technology will be enabled in future chips. However, new-generation mainstream servers will not get it.

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KitGuru Says: While erratums have emerged in the past, with Haswell and Broadwell Intel seems to have experienced a lot of small problems that do not impact its business performance significantly, but makes us think about viability of the Tick-Tock strategy in general. Under the Tick-Tock plan, the company just has to introduce something new every year. In many cases it means rather tight schedules for everyone, which may cause things like limited overclocking potential of Intel’s Haswell, issues with 14nm process technology or the TSX erratum.

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Intel reaffirms plans to ship ‘Broadwell’ chips in late 2014 https://www.kitguru.net/components/cpu/anton-shilov/intel-reaffirms-plans-to-start-shipments-of-broadwell-chips-in-late-2014/ https://www.kitguru.net/components/cpu/anton-shilov/intel-reaffirms-plans-to-start-shipments-of-broadwell-chips-in-late-2014/#respond Tue, 12 Aug 2014 03:14:17 +0000 http://www.kitguru.net/?p=206898 Intel Corp. on Monday reaffirmed plans to start shipments of its next-generation code-named “Broadwell” microprocessors in late 2014 and to make them available in mass quantities in 2015. The announcement is made to persuade investors and partners that there will be no further delays with Intel’s new products as well as the roll-out of 14nm …

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Intel Corp. on Monday reaffirmed plans to start shipments of its next-generation code-named “Broadwell” microprocessors in late 2014 and to make them available in mass quantities in 2015. The announcement is made to persuade investors and partners that there will be no further delays with Intel’s new products as well as the roll-out of 14nm process technology.

As expected, the first processors based on the Broadwell micro-architecture will be the Core M chips that will be on shelves for the holiday selling season followed by broader OEM availability in the first half of 2015. Core i-series processors for mobile and desktop PCs will become available in 2015, just like projected.

Intel also revealed that its architects and chip designers have achieved greater than two times reduction in the thermal design point (TDP) when compared to a previous generation of processor while providing comparable performance and longer battery life. The company did not reveal exact TDPs of its upcoming Core M microprocessors.

intel_core_m_broadwell_14nm

The world’s largest chipmaker also stressed that despite of multiple fixes it had to implement into its 14nm process technology, the process will be used to make a wide range of high-performance to low-power products including those for servers, personal computing devices and Internet of Things.

“Intel's 14 nanometer technology uses second-generation Tri-gate transistors to deliver industry-leading performance, power, density and cost per transistor,” said Mark Bohr, Intel senior fellow and the head of the company’s technology and manufacturing group. “Intel's investments and commitment to Moore's law is at the heart of what our teams have been able to accomplish with this new process.”

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KitGuru Says: Intel’s announcement is neither good nor bad. We already know that the high-performance “Broadwell” chips are delayed to Q3 2015, whereas availability of 14nm CPUs this year will be limited. The most important thing that Intel revealed on Monday is the fact that the 14nm fabrication technology will be used to make various solutions, which should mean that the majority of issues with the process had been fixed.

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Apple delays launch of MacBook Air 12” because of Intel’s ‘Broadwell’ https://www.kitguru.net/lifestyle/mobile/apple/anton-shilov/apple-delays-launch-of-macbook-air-12-because-of-intels-broadwell/ https://www.kitguru.net/lifestyle/mobile/apple/anton-shilov/apple-delays-launch-of-macbook-air-12-because-of-intels-broadwell/#respond Wed, 23 Jul 2014 04:23:22 +0000 http://www.kitguru.net/?p=204211 Being a very close partner of Intel Corp., Apple naturally depends on the chipmaker’s ability to supply new central processing units on time. Apparently, the delay of Intel’s next-generation code-named “Broadwell” processor caused Apple to reconsider its own plans and now the highly-anticipated MacBook Air 12” with retina-class display is expected to be launched only in …

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Being a very close partner of Intel Corp., Apple naturally depends on the chipmaker’s ability to supply new central processing units on time. Apparently, the delay of Intel’s next-generation code-named “Broadwell” processor caused Apple to reconsider its own plans and now the highly-anticipated MacBook Air 12” with retina-class display is expected to be launched only in 2015.

Apple MacBook Air 12” was originally expected to be released in Q2 2014 or Q3 2014, but it could be late and only emerge in 2015, reports 9to5Mac. The device is projected to feature a new clamshell structure, which is expected to make the new MacBook Air (MBA) even thinner and lighter than the current-generation models. Moreover, since Intel’s “Broadwell” microprocessors made using 14nm process technology are supposed to consume a very limited amount of power and emit a very limited amount of heat, the all-new MacBook Air 12” is expected to be fanless.

Since the MacBook Air 12” seems to be designed from the ground-up to be powered by Intel’s “Broadwell” microprocessor, the delay of the latter naturally delays the new MBA.

apple_macbook_air_2

It is now expected that Apple will introduce its new MacBook Air 11″ and 13″ laptops with Intel Core i-series “Haswell Refresh” chips this year. The new notebooks will hardly be too different from existing models and therefore will not catalyse currentowners to upgrade.

Keeping in mind the fact that Intel reportedly intends to release its all-new next-generation code-named “Skylake” processors in the second quarter of next year, it is possible that Apple will skip the “Broadwell” and adopt its successor instead. Still, keeping in mind that Apple may get priority shipments from Intel, it may simply get the “Broadwell” well ahead of other PC makers and there will be no reason to wait for the “Skylake” chips.

Apple and Intel did not comment on the news-story.

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KitGuru Says: It was a matter of time before the first reports about product launch delays because of Intel’s issues with “Broadwell” emerge. It is logical to expect other makers of PCs, which pinned hopes on Intel’s low-power “Broadwell” chips, to also delay their innovative products.

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Intel ‘Broadwell’ chips will be available for two weeks in 2014 https://www.kitguru.net/components/cpu/anton-shilov/intel-broadwell-chips-will-be-available-for-two-weeks-in-2014/ https://www.kitguru.net/components/cpu/anton-shilov/intel-broadwell-chips-will-be-available-for-two-weeks-in-2014/#comments Wed, 09 Jul 2014 19:49:49 +0000 http://www.kitguru.net/?p=202228 Brian Krzanich, chief executive officer of Intel Corp., once said that the company’s upcoming microprocessors code-named Broadwell would be available by the holiday season and “not at the last second of holiday.” According to a revised launch schedule of Intel’s 14nm chips, the Broadwell family of central processing units will be available for two weeks …

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Brian Krzanich, chief executive officer of Intel Corp., once said that the company’s upcoming microprocessors code-named Broadwell would be available by the holiday season and “not at the last second of holiday.” According to a revised launch schedule of Intel’s 14nm chips, the Broadwell family of central processing units will be available for two weeks this calendar year.

For an unknown reason Intel decided to postpone the launch window of the Core M “Broadwell” microprocessors to the ww51 2014 – ww03 2015 (late December – late-January) from the ww37 – ww40 (September, 2014), according to a new schedule published by Chinese VR-Zone web-site. If devices based on the Core M central processing units emerge on the market on the 51st week of the year (late December), they will only be available in retail for no more than a couple of weeks in calendar 2014.

intel_core_m_broadwell_shipments_schedule

The first Intel Core M processors based on the Broadwell micro-architecture, previously known as the code-named Broadwell-Y chips, are the most energy-efficient central processing units in the family. The initial Core M chips feature two x86 cores with the Hyper-Threading technology, the Intel HD Graphics core with 24 execution units and various enhancements, 3MB of L3 cache, dual-channel DDR3 memory controller as well as a core-logic placed on the same piece of substrate as the processor. The Core M (BDW-Y 2+2) chips will have scenario design power of 4.5W – 11.5W. Intel’s partners will use the new chips for 2-in-1s, high-end tablets or ultra-thin laptops.

It is interesting to note that during the ww51 2014 – ww03 2015 launch window the world’s largest chipmaker also plans to release the Broadwell-U (BDW-U 2+2) microprocessors, which will feature two cores with HT, Intel HD graphics with 24 execution units, 3MB of cache, dual-channel DDR3 DRAM controller, integrated core-logic and thermal design power between 15W and 28W. In addition, the firm is projected to release Celeron- and Pentium-branded Broadwell (BDW 2+1) chips with two cores and a simplistic graphics engine. More powerful Broadwell-U (BDW-U 2+3) chips for higher-performance notebooks will be available starting from the 5th week of next year.

intel_core_broadwelll_y_series_system-on-chip_soc

While there are no official explanations why Intel decided to postpone the launch of the Core M “Broadwell-Y” microprocessors from September to December, it is likely that this was done because of the yield issues with the company's 14nm process technology. In a bid to hand-pick low-power BDW-Y chips with all units functional Intel has to bin (test) more processors than originally expected. As a result, it takes more time to get the amount of chips the company needs for a commercial launch. A side benefit of this is Intel’s ability to release the Broadwell-U and the low-cost Broadwell-U 2+1 chips along with the premium Core M offerings.

Intel did not comment on the news-story.

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KitGuru Says: The new information from Intel’s documents reaffirms that Intel has major problems with its 14nm process technology and/or the Broadwell design of microprocessors. As a consequence of such issues mass availability of the new chips slips into 2015.

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Wide availability of Intel’s ‘Broadwell’ chips slips to 2015 https://www.kitguru.net/components/cpu/anton-shilov/wide-availability-of-intels-broadwell-chips-slips-to-2015/ https://www.kitguru.net/components/cpu/anton-shilov/wide-availability-of-intels-broadwell-chips-slips-to-2015/#comments Fri, 20 Jun 2014 15:52:40 +0000 http://www.kitguru.net/?p=199373 While Intel Corp. has publicly announced that the first systems based on the code-named “Broadwell” processors will be available by Christmas, it now looks like actual availability of such PCs will be rather scarce. Apparently, only “initial” devices based on the Broadwell processors will show up this year, whereas mass availability of such products is …

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While Intel Corp. has publicly announced that the first systems based on the code-named “Broadwell” processors will be available by Christmas, it now looks like actual availability of such PCs will be rather scarce. Apparently, only “initial” devices based on the Broadwell processors will show up this year, whereas mass availability of such products is now expected in 2015.

“We expect the initial Broadwell-based devices, including fanless 2-in-1s built on the Core M processor, will be on shelves by the end of this year with more products and broader OEM availability in 2015,” a statement by Intel published by Cnet News reads.

The first Intel Core M processors based on the Broadwell micro-architecture, previously known as the code-named Broadwell-Y chips, are the most energy-efficient, yet, the lowest-performing central processing units in the family. The initial Core M chips feature two x86 cores with the Hyper-Threading technology, the Intel HD Graphics core with 24 execution units and various enhancements, 3MB of L3 cache, dual-channel DDR3 memory controller as well as a core-logic placed on the same piece of substrate as the processor.

intel_core_broadwelll_y_series_system-on-chip_soc

Intel has not officially revealed actual power consumption of the new Core M (BDW-Y 2+2) chips, but it is likely that there will be CPUs with scenario design power of around 4.5W or lower. With power consumption of 4.5W – 11.5W, it is possible to expect Intel’s partners to use the new chips for 2-in-1s, high-end tablets or ultra-thin laptops.

Previously it was expected that Intel would roll-out the code-named Broadwell-U processors (BDW-U 2+2) with 15W – 28W thermal design power designed for thin and mainstream notebooks in 2014. However, it now looks like Intel will only release the most energy-efficient versions of the Broadwell this year.

The Broadwell seems to be a very unlucky design for Intel. While most probably the chip is very energy efficient, it will be late to market by several quarters. At present rumours about insufficient yields of the Broadwell chips, which are produced using the 14nm fabrication process, are circulating around the industry. Intel earlier this year said that it had fixed all the yield-related issues of the new process technology discovered in 2013. Still, the fact that Intel is set to begin the roll-out of the Broadwell with the smallest version of the chip may be considered as a yield improving technique (since smaller chips are easier to make).

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KitGuru Says: If Intel really decided to postpone the release of the Broadwell-U chips to 2015, it will be interesting to know how that will affect launch schedules of the rest CPUs in the Broadwell family. Perhaps, the long-awaited Broadwell-K processor will be postponed again?

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Intel licenses wireless charging technology from WiTricity https://www.kitguru.net/desktop-pc/anton-shilov/intel-licenses-wireless-charging-technology-from-witricity/ https://www.kitguru.net/desktop-pc/anton-shilov/intel-licenses-wireless-charging-technology-from-witricity/#respond Fri, 13 Jun 2014 21:36:10 +0000 http://www.kitguru.net/?p=198316 At the Computex 2014 trade-show Intel Corp. announced that its reference designs based on the Skylake generation of microprocessors will support Rezence, a wireless charging standard developed by the Alliance 4 Wireless Power (A4WP). This week Intel actually licensed wireless charging solutions for computing devices designed by WiTricity. The A4WP’s Rezence near-field resonant technology has …

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At the Computex 2014 trade-show Intel Corp. announced that its reference designs based on the Skylake generation of microprocessors will support Rezence, a wireless charging standard developed by the Alliance 4 Wireless Power (A4WP). This week Intel actually licensed wireless charging solutions for computing devices designed by WiTricity.

The A4WP’s Rezence near-field resonant technology has a lot of advantages compared to other wireless charging technologies based on induction. Rezence allows to charge devices with up to 50W power requirements though other materials (e.g., wood, plastic) and provides simultaneous charging of multiple devices with different power requirements. The technology further offers ‘spatial freedom’ for additional reach in the z-direction, eliminating the hassle of accurate coil alignment – all on a single charging surface or in a charging region.

The agreement between Intel and WiTricity will allow the chip giant to integrate the latter’s implementation of the Rezence battery-charging into its reference designs, which will then be used by its partners to develop their products. It is unknown whether the actual makers of Intel-based based PCs, 2-in-1s, tablets and smartphones will also have to buy separate licenses, or those expenses will be somehow covered by Intel.

witricity_intel_wireless_charging_skylake_wit-2000m-mobile-developer-kit

The decision to license the actual physical implementation of the Rezence battery-charging technology underlines the importance of wireless charging for Intel. The company will most probably incorporate Rezence into as many designs as possible, which will have a direct influence on the market.

Without a strong rival on the market of personal computers and powerful 2-in-1s, Intel has one simple reason to incorporate wireless charging into Skylake-based offerings: to provide those devices a strong advantage compared to the previous-generation products. In case the company will somehow help its partners to implement wireless charging and maybe provide incentives for integration of the technology, the demand for new gadgets will increase and so will sales of Intel’s chips, such as Atom, Core M or Core i families.

[yframe url='http://www.youtube.com/watch?v=wM8XkUeFcjc']

“We have overwhelming feedback from end users that they are frustrated with dealing with all the different wires and power adapters for their devices – phones, tablets & PCs,” said Sanjay Vora, vice president and general manager of user experience at Intel. “At Intel, we have a vision to eliminate all wires from all of our platforms. This agreement is a major step in the right direction enabling our companies to work together to deliver the next generation of devices that eliminate the need for power cords.”

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KitGuru Says: Without any doubts, wireless charging brings a lot of advantages to mobile devices. The only question is how much will such technology cost to the end-user initially?

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Intel reveals Core M ‘Broadwell’ 14nm microprocessors https://www.kitguru.net/components/cpu/anton-shilov/intel-reveals-core-m-broadwell-14nm-microprocessors/ https://www.kitguru.net/components/cpu/anton-shilov/intel-reveals-core-m-broadwell-14nm-microprocessors/#respond Wed, 04 Jun 2014 19:05:29 +0000 http://www.kitguru.net/?p=196591 At the Computex trade-show in Taipei, Taiwan, Intel Corp. introduced its first microprocessors based on the code-named “Broadwell” micro-architecture aimed at ultra-thin high-performance tablets, notebooks and 2-in-1s. The new central processing units (CPUs) are called the Core M and will emerge on the market later this year. The chipmaker also introduced innovative Core M-based reference …

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At the Computex trade-show in Taipei, Taiwan, Intel Corp. introduced its first microprocessors based on the code-named “Broadwell” micro-architecture aimed at ultra-thin high-performance tablets, notebooks and 2-in-1s. The new central processing units (CPUs) are called the Core M and will emerge on the market later this year. The chipmaker also introduced innovative Core M-based reference designs.

Previously known as the code-named Broadwell-Y, the new Core M chips feature two x86 cores with the Hyper-Threading technology, the Intel HD Graphics core with 24 execution units and various enhancements, 3MB of L3 cache, dual-channel DDR3 memory controller as well as a core-logic placed on the same piece of substrate as the processor. At present Intel does not reveal actual power consumption of the new Core M (BDW-Y 2+2) chips, but it is likely that there will be CPUs with scenario design power of around 4.5W or lower.

intel_core_m_broadwell_llama_mountain

At the Computex show Intel also demonstrated two Intel Core M-based reference designs for 2-in-1 systems, code-named “Llama Mountain.” The 12.5” version of the Llama Mountain features 2560*1440 IGZO display (developed by Sharp), when its keyboard is detached, it measures only 7.2mm thin and weighs only 670 grams. The 10” tablet version of the “Llama Mountain” is just 550 grams and a mere 6.8mm thin, which is comparable to the Apple iPad 4.

Intel claims there are three times the volume of new 2-in-1 designs in the pipeline compared with a year ago; 50 per cent of these designs are expected to hit mainstream price points below $700.

The Intel Core M processor will be the first 14nm product on the market market in the second half of this year, Intel said. Earlier this year Intel said that the Core M-based systems would be available by Christmas.

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KitGuru Says: While we have no doubts that Intel can built an Apple iPad-like tablet or even a 2-in-1 device of a similar size, it remains to be seen whether the “Llama Mountain” design will be actually adopted by commercial products. Usually Intel’s reference designs utilise state-of-the-art components that are pretty expensive or are not in mass production.

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