As technology advances, the demand for faster computation is increasing, leading chip designers to seek ways to integrate more components into processors. At IEDM 2023, during a technical session, Intel researchers demonstrated their latest technological breakthrough that will allow just that: 3D-stacked CMOS transistors with backside power and direct backside …
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SK Hynix is reportedly hiring design staff for logic devices, such as CPUs and GPUs, to develop a stacking method to put HBM4 directly on top of them. This would revolutionize the foundry sector by changing how logic and memory components are coupled and manufactured. As per the same report, …
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