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Tag Archives: HMC 3.0

Micron to unveil third-gen hybrid memory cube in 2016

Micron Technology is working on the third generation of its hybrid memory cube technology, which will be unveiled next year. If the third-gen HMC doubles data rate of the memory from 15Gb/s today, then the new memory technology will offer unprecedented bandwidth. HMC uses advanced through-silicon vias (TSVs) – vertical …

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