Tag Archives: tape out

Bolt Graphics has officially announced the successful tape-out of its Zeus GPU test chip based on TSMC's 12nm FFC process node. This architecture, which has undergone four years of FPGA testing and customer evaluation, is designed as a highly scalable compute platform targeting high-performance computing (HPC), AI, and professional rendering.  …

The next major desktop platform in Intel's client CPU portfolio, “Nova Lake-S”, has reportedly taken a significant step towards reality. According to a new report, a compute tile for the next-generation desktop processor has successfully “taped out” at TSMC's facilities in Taiwan. Based on the new report from SemiAccurate (via …