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At IEDM, TSMC shared its plans to provide MCM-based chips with over one trillion transistors and monolithic chips with over 200 billion transistors by 2030. To accomplish that target, the company said it is working on 2nm-class N2 and N2P production nodes, as well as 1.4nm-class A14 and 1nm-class A10 …
Read More »TSMC expects to create chip packages with over 1 trillion transistors by 2030
