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ARM and TSMC have announced their co-developed silicon-proven chiplet system based on multiple ARM cores, using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution, which is heralded as an industry first based on the 7nm FinFET process. The proof-of-concept chip comprises of a dual-chiplet CoWoS implemented in 7nm. Each chiplet contains four ARM …
Read More »TSMC and ARM showcase first 7nm chiplet system for HPC
