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EK announced the release of the EK-Loop Thermal Paste NGP (5g), a thermal interface material designed for high-end components. This paste uses nano-grade particles to ensure efficient heat transmission between CPUs, GPUs, and other chipsets and their cooling solutions, such as water blocks and heatsinks.
Built on Nano-Grade Particles (NGP) technology, the EK-Loop NGP thermal paste offers low thermal impedance and good applicability. These nano-grade particles are designed to produce a thin layer between the heat source and the cooler, resulting in efficient heat dissipation. The low thermal impedance helps the paste transmit heat efficiently.
The EK-Loop NGP thermal paste can be used on various systems (gaming PCs, workstations, and servers), focusing on crumpling resistance and long-term performance. It guarantees stability for users in varied conditions and shows versatility for various circumstances. EK's new thermal paste operates from -20°C to 125°C, maintaining constant performance and avoiding heat deterioration across the range. Its dielectric qualities guarantee the paste performs well without generating excessive pressure.
Moreover, EK claims the paste is easy to apply and spread, making it suitable for experienced users and newcomers. The syringe contains five grammes of paste, which should be enough for a few applications. To make the application even more accessible, the package comes with a black spatula that you may use to spread the paste. The EK-Loop Thermal Paste NGP (5g) is now available for €9.90.
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