Xiaomi is trying to improve the cooling of its phones with a new system called Loop LiquidCool. Designed to succeed vapour chambers, Xiaomi claims the new cooling technology has “twice the cooling capabilities and ranks as the most efficient smartphone cooling solution” available today.
As per Xiaomi, its new cooling technology takes cues from the aerospace industry. Composed of an evaporator, a condenser, a refill chamber and multiple pipes, Xiaomi’s Loop LiquidCool system sends liquid to the heat source, vaporizes it, and then disperses it throughout the heatsink to condense. Once this process ends, the liquid is captured and sent once again through the loop.
Compared to the older VC liquid cooling system found in older Xiaomi phones, the Loop LiquidCool technology is somewhat similar, as it uses the same method. However, there are key differences between both, including the ring-shaped pump featuring a special gas pipe design and the dedicated channels for gases and liquids. These improvements result in less air passage resistance (about 30%) and improved steam flow, increasing heat transfer capacity by 100%.
To showcase the capabilities of the new cooling system, Xiaomi compared a standard Mi Mix 4 and a Mi Mix 4 using the Loop LiquidCool system. Both phones ran Genshin Impact for 30 minutes at 60FPS with max video settings. After the run, the custom Mi Mix 4 casing was 5.2ºC colder in its hotspot, and the CPU was 8.6ºC colder, compared to the standard Mi Mix.
Xiaomi plans to launch the first phones featuring its Loop LiquidCool technology starting H2 2022.
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KitGuru says: Besides improving temperatures, the new cooling system is also smaller than Xiaomi’s current solution. This could allow the company to make thinner and smaller phones, as they have more space to house the components.