Leaker claims chips for PS6 and Xbox Helix are ‘taped out’

According to hardware leaker Kepler_L2, early silicon for Sony’s PlayStation 6 and Microsoft’s next‑generation Xbox Project Helix may have reached the tape‑out stage. The claim was shared online this week, where the leaker also outlined initial compute targets for both systems.

In the NeoGAF posts, first spotted by Videocardz, Kepler suggests the PS6 GPU is currently aiming for around 40 TFLOPS, while Xbox Helix may target roughly 56 TFLOPS. These numbers represent theoretical FMA throughput rather than real‑world gaming performance. As the leaker notes, TFLOPS alone do not account for memory bandwidth, ray tracing hardware, clock speeds or architectural differences, meaning the figures should not be interpreted as direct indicators of in‑game performance.

Kepler has previously shared other early expectations for next‑generation hardware, including claims that Sony may adopt GDDR7 memory and that both consoles will use a mix of Zen 6 and RDNA 5 architecture. However, details such as memory configuration, bandwidth targets and ray tracing hardware remain unconfirmed, and Microsoft’s approach to system design is still largely unknown. As with all early console rumours, these points may change as silicon testing progresses.

Kepler also commented on the typical development timeline for new console SoCs, suggesting that if tape‑out has occurred, next‑generation hardware could be tracking toward a late‑2027 release window. None of the companies involved have confirmed specifications, timelines or architectural details.

KitGuru Says: As always with early console rumours, these figures should be treated cautiously. If tape‑out has taken place, more reliable details should emerge as silicon testing progresses.

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