Intel Nova Lake will reportedly use a dual-lever socket for improved cooler contact

For a long time now, Intel's CPU sockets have used a single-lever system to lock the chip into place. Apparently for the next generation Nova Lake chips, Intel will go back to embracing a dual-lever mechanism, which will also allow Intel to make the IHS on top of the CPU flatter. 

According to VideoCardz, Intel will shift to this 2L-ILM for the Z990 and higher-end boards. By returning to a dual-lever system similar to LGA-2011, Intel can ensure a more uniform distribution of pressure across the entire IHS.

This dual-lever design should also remove the need for additional contact frames to improve cooling performance, which some have used on Arrow Lake boards for better cooler-to-CPU contact.

Intel has not yet made any official announcements about its next-gen Nova Lake desktop processors, but we should be getting official information later in the year, perhaps as early as Computex in June, but Intel also likes to host its own events around September and October.

KitGuru says: Do you think Intel will take back the gaming performance crown with Nova Lake? 

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