Cooler Master and Murata have partnered up once again. This time, instead of a PSU, both companies have co-developed the world's thinnest heat dissipator for electronic devices — a 200μm vapour chamber. As electronics evolve, the power consumption and heat generated by chips tend to increase, making cooling an important …
Read More »Intel expected to announce innovative Project Athena cooling solutions at CES
Intel is expected to announce at CES that Project Athena laptops will feature an innovative vapor chamber and graphite sheet cooling solution
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