The Coolink Corator DS cooler is packaged in a full colour box highlighting the heatsink on the front with artistic green accented background imagery.
The back and sides highlight the main selling points and some specifications of the product.
Inside the box there are two smaller boxes, one housing the cooler itself and the other a slimline box with all the accessories.
The bundle comes with and Intel and AMD kit and two manuals for either platform. This is basically identical to the Noctua cooler bundles we have reviewed on Kitguru in the past. They also supply a little tube of their own thermal paste called ‘Chillaramic thermal compound’, which also looks identical in component breakdown to the Noctua NT H1 paste.
The cooler itself is extremely well engineered as we would expect from the same company who produce Noctua coolers. The heatpipes are thick 8mm units and the base is ‘Gapless Direct Touch’. They carefully package the product with a hard plastic protective cover over the base to protect against marks during shipping.
Interestingly we counted the fins on either side and one fin stack has 30fins and the other 40 fins, this could in theory have a slightly negative effect on the airflow. The unit is a dual tower design with the 120mm fan in the middle – preinstalled. Another fan could be fitted on the cooler if you decided to enhance the airflow, however there are only one set of mounting clips supplied, so a litle creative ingenuity with materials would be required.
The cooling fins have the heatpipes running all the way through them as they exit at the top. The shapes are intended to cause airflow turbulence which increases the fins capabilities to dissipate heat.
The copper base is a rather unique aspect of the Corator DS as the Gapless Direct Touch design is a first. It uses Direct Touch technology which is a favourite among enthusiast circles, but it doesnt have gaps between the heatpipes as they touch the heatspreader of the CPU. This is a very interesting and unusual concept as Coolink have poured a copper layer over and between the flattened heatpipes. In theory this is one of the best cooling methodologies we have seen as it utilises the best aspects of both HDT and solid base designs.