Rumours have been pointing to new EPYC “Milan” processors with 3D V-Cache for quite some time. Now, new leaks have revealed specifications for the upcoming line-up, which is codenamed “Milan-X”. 

The specifications were leaked by @ExecutableFix, detailing four SKUs of the upcoming AMD EPYC7003x processors employing AMD's new X3D packaging technology, a hybrid of 2.5 and 3D packaging. Based on the leak, these SKUs will come with up to 768MB of L3 cache, up to 64x cores and boost clock speeds as high as 3.8GHz. The 32-core and 64-core SKUs will come with a 280W TDP, while the 16-core and 24-core SKUs will have a 240W TDP.

You can check the leaked specifications of the AMD EPYC 7003x series processors in the following table:

SKU	Cores	Base Clock	Boost Clock	L3 Cache	TDP
EPYC 7773X	64	2.2GHz	3.5GHz	768 MB	280W
EPYC 7573X	32	2.8GHz	3.6GHz	768 MB	280W
EPYC 7473X	24	2.8GHz	3.7GHz	768 MB	240W
EPYC 7373X	16	3.05GHz	3.8GHz	768 MB	240W

One retail listing for a new Milan-X SKU already appeared last month, suggesting that we might not be waiting much longer to see an official launch. With that said, AMD has yet to confirm or announce anything officially.

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KitGuru says: 768MB is a lot of L3 cache – compared to the EPYC 7003 series, that's a 3X improvement. The sheer amount of L3 cache might make Milan-X an attractive alternative to standard Milan chips, even if they come at a higher price.

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