G.Skill will soon launch new R-DIMM memory with 16-layer PCB and voltage protection

G.Skill is raising the bar for server and workstation performance with its latest release: an enhanced version of DDR5 R-DIMM memory sticks. Built to the recently announced JEDEC specifications, these new memory sticks will feature a 16-layer PCB for improved signal integrity and incorporate robust voltage protection for enhanced reliability and stability.

A key upgrade in these new DDR5 R-DIMM modules is the implementation of a 16-layer PCB, a significant advancement over previous 8- or 10-layer designs. This increased layer count enhances signal integrity, resulting in more reliable and stable data transfer, even under demanding high-performance or overclocked conditions. This makes G.Skill's new DDR5 R-DIMM an ideal solution for high-performance computing applications in server and workstation environments.

Moreover, each module incorporates two bidirectional transient voltage suppression (TVS) diodes and a fuse to improve reliability, providing dual-layer protection against unexpected power fluctuations. This design safeguards the memory from voltage spikes, ensuring maximum stability and dependability for mission-critical workloads and next-generation high-performance computing systems.

These new DDR5 R-DIMM memory kits are expected to be available starting in mid-2025.

KitGuru says: If you plan on building a new server or workstation later this year, will you consider using G.Skill's upcoming enhanced R-DIMMs?

Become a Patron!