Computex 2026: G.Skill’s new low latency DDR5 kits, active cooling for DDR5 and more

At Computex 2026, G.Skill showcased its new Ultra Low Latency DDR5 memory for AMD PCs, alongside its first actively cooled memory, and new ultra high-speed kits that push speeds beyond 10,000MT/s. 

Timestamps:
00:00 Active cooling
00:58 Trident Z5 NEOX RGB
01:53 Memory platforms
03:23 MSI MEG X870E on 8000 UDIMM’s
03:39 Workstation systems
04:42 DDR5 10000 512GB RDIMMs
05:00 Modded Systems

At Computex this year, G.Skill held its 12th Annual OC World Cup, putting the 12 best overclockers to the test in a series of competitive challenges. While German overclocker CENS won the grand prize last year, there was a new OC world champion for 2026 – bl4ckdot.

Moving on to new products at G.Skill's Computex booth, first we have the new active coolers for DDR5 memory, developed by Cooler Master to help reign in temperatures on newer, ultra-high-speed memory kits. G.Skill is also amongst the first memory companies to support AMD's new EXPO Low Latency tuning profile, with new Trident Z5 NeoX kits making use of it, bringing latency for DDR5-6000 down to CL26.

G.Skill wanted to shine a light on its new DDR5-9200 32GB CU-DIMM kit, delivering high speeds at just 1.1V. That's not all though, as G.Skill also has kits that break the DDR5-10000 barrier, including a 512GB R-DIMM kit for Intel Xeon systems, and a more traditional 48GB DDR5 kit running at 10933MT/s.

As with many other companies, enterprise is a bigger point of focus this year. For those customers, G.SKILL is demonstrating setups with DDR5‑8000 256GB (128GBx2) 4R CU‑DIMM, DDR5‑6400 256GB (64GBx4) ECC CU‑DIMM, and a DDR5‑8800 768GB (96GBx8) R‑DIMM setup for workstations and AI systems.

KitGuru Says: What did you make of G.Skill's Computex showing this year?

Become a Patron!