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AMD Zen 4 “Raphael” CPU package mock-up revealed, 170W TDP reportedly a possibility

A known leaker recently posted some new information about AMD’s upcoming AM5 platform, which will apparently bring about a change from PGA (pin grid array) socket design, where the processor features the connection pins, to an LGA (land grid array) socket platform, where the pins are featured on the motherboard. Now using this information, we have a mock-up design of what AMD’s AM5 CPU design may look like, while also sharing some additional information on the upcoming Zen 4 architecture. 

According to ExecutableFix, AMD’s first Zen 4 processors, codenamed ‘Raphael’, will be based on the AM5 platform with an LGA 1718 socket and support for DDR5 memory. There will be 28x PCIe 4.0 lanes, which is an increase of 4 compared to its predecessor, and the TDP is set at 120W, but 170W is also possible.

 

The report also claims that AM5 won’t support PCIe 5.0 at first, which may put it behind Intel counterparts in some aspects. However, that shouldn’t affect the experience of most users, as devices making use of PCIe 5.0 connectivity will still take some time to reach the mainstream market.

AMD’s Raphael processor architecture is expected to power the Ryzen 7000 series, which should release in Q4 2022. Given the launch date, it will probably rival Intel’s Raptor Lake-S processors.

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KitGuru says: A 120W TDP is acceptable in a mainstream CPU for today’s standards, but a 170W TDP can be troublesome to cool. If AMD launches a CPU with such a high TDP, it would have to feature a high core count or high boost clocks to justify it. Whether the 170W TDP claim is true, we will have to wait to see it.

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