CES 2026: Gigabyte refreshes 800-series motherboard lineup with four new models

Gigabyte has used CES 2026 to showcase a specialised lineup of motherboards designed to squeeze every last frame out of AMD's Ryzen 9000 Series X3D processors. Leading the charge is the X870E Aorus Xtreme X3D AI Top, a flagship board focused on high‑frequency memory stability and aggressive thermal management for the latest 3D V‑Cache silicon.

The new X870E Aorus Xtreme X3D AI Top is Gigabyte's first AMD 800‑series motherboard to officially support DDR5‑9000+ memory speeds. Achieving these frequencies on the AM5 platform requires specific conditions, so Gigabyte has implemented “AI‑Trace” technology to optimise PCB routing and a 24+2+2‑phase VRM to ensure power delivery remains ripple‑free under load. To prevent thermal throttling during high‑speed memory operation, the board includes the DDR Wind Blade Xtreme solution, which allegedly reduces module temperatures by up to 9°C.

Complementing the memory cooling is a suite of thermal “Xtreme” features. The CPU Thermal Matrix is designed to more efficiently pull heat away from the socket area, dropping VRM and DDR temperatures by a claimed 8.5°C. For storage enthusiasts, the M.2 Thermal Guard Xtreme provides a large surface area for primary Gen5 SSDs, which the company states can lower drive temperatures by up to 22°C.

On the software side, Gigabyte is debuting X3D Turbo Mode 2.0. While the initial version of Turbo Mode was a simple BIOS toggle to park a CCD or disable Simultaneous Multithreading (SMT), the 2.0 revision uses an AI‑trained model to adapt these parameters in real time. By disabling SMT and focusing resources on the primary CCD during gaming, Gigabyte claims up to 25% performance gains in specific CPU‑bound scenarios. Unlike a static overclock, this mode is designed to be a “one‑click” optimisation that balances hardware power without requiring manual voltage tuning.

Beyond raw performance, Gigabyte is also catering to aesthetic and “clean build” trends. The X870E Aero X3D Wood breaks from the traditional gamer aesthetic by incorporating genuine wood‑grain textures and leather accents on the heatsinks. Meanwhile, the Project Stealth initiative is expanding with the X870 and B850 Aorus Stealth models. These boards utilise a reverse‑connector layout, moving all power and data headers to the back of the PCB to allow for a virtually cable‑free interior when paired with a compatible chassis.

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KitGuru says: While DDR5-9000 is an impressive claim for the AM5 platform, it's the combination of the AI-driven Turbo Mode 2.0 and the proactive “Wind Blade” cooling that makes the new Aorus Xtreme motherboard a true high-end product.

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