Tag Archives: PowerVia

Today Intel is unveiling its latest innovation – PowerVia, a new power delivery method set to debut on the Intel 20A process node in 2024. This marks Intel as the first in the industry to implement backside power delivery on a product-like test chip.  Speaking on PowerVia, Ben Sell, Intel …

Today Intel has revealed its roadmap of process and packaging improvements, which will power the next several generations of Intel CPUs leading up to 2025 and beyond. This includes Intel's first new transistor architecture in more than a decade.