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TSMC and ARM showcase first 7nm chiplet system for HPC

ARM and TSMC have announced their co-developed silicon-proven chiplet system based on multiple ARM cores, using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution, which is heralded as an industry first based on the 7nm FinFET process. The proof-of-concept chip comprises of a dual-chiplet CoWoS implemented in 7nm. Each chiplet contains four ARM …

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Toshiba’s Serial NAND flash memory offers a performance and capacity boost

Toshiba has announced it will launch its second generation of NAND flash memory products, featuring increased performance and capacity, while offering support for high-speed data transfer rates. Toshiba’s second generation of NAND flash memory products for embedded systems will be compatible with the widely used Serial Peripheral Interface (SPI). According …

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