Foxconn has reportedly begun construction on a new advanced semiconductor assembly and test plant this week. Located in Qingdao, northeast China, this facility is expected to be used to manufacture “solutions for 5G and AI related” devices.
When looking into investments made in the semiconductor sector, it’s easy to stumble across hefty sums of money. For example, one week ago it was reported that Foxconn is expected to invest $1 billion on iPhone assembly facilities in India. This number, however, is dwarfed by the $8.6 billion that Foxconn is expected to pour into an advanced semiconductor assembly located in Qingdao, China.
Foxconn is far from alone in investing massive amounts of resources into new factories. TSMC, is funnelling approximately $12 billion into building and operating a new fab in the United States.
Foxconn’s new China fab is said to be designed to manufacture “solutions for use in 5G and AI related device applications” and the plant is expected to be ready for production in 2021. Production volume is expected to be reached by 2025 with a monthly capacity of 30,000 12-inch wafers.
KitGuru says: Foxconn is expanding its presence in China, similarly to many other semiconductor companies at the moment.