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Intel H670, B660 and H610 motherboard details leak

Intel is expected to unveil its mid-range and entry-level 600-series motherboards at CES 2022, but leakers already seem to have some of the details. This week, specifications for the upcoming H670, B660 and H610 chipsets were revealed. 

Twitter leaker @momomo_us has posted new details on Intel’s upcoming motherboards, which will offer a cheaper entry point for those looking to build an Intel 12th Gen Core “Alder Lake” powered PC. According to the leak, these remaining chipsets will not offer CPU overclocking, but they will support DDR4 and DDR5 memory, leaving it to motherboard vendors to choose which memory standard to support.

The H670-based motherboards will come with 8x DMI 4.0 lanes and 12x PCIe 4.0 lanes, but only 12x PCIe 3.0 lanes. Some cuts have also been made for USB connectivity, featuring 2x USB 3.0 (20G) ports, 4x USB 3.0 (10G) ports, 8x USB 3.0 (5G) and 14x USB 2.0 ports. Lastly, there’s also 8x SATA 3.0 ports.

The B660 range makes a few more cuts, offering 4x DMI 4.0 lanes, 6x PCIe 4.0 lanes, 8x PCIe 3.0 lanes and 4x SATA 3.0 ports, as well as 2x USB 3.0 (20G) ports, 4x USB 3.0 (10G) ports, 6x USB 3.0 (5G) and 12x USB 2.0 ports.

Finally, there are the entry-level H610 boards, which cut PCIe 4.0 entirely and only support PCIe 3.0. For connectivity, you get 4x DMI 4.0 lanes, 8x PCIe 3.0 lanes, 2x USB3.0 (10G) ports, 4x USB 3.0 (5G), 10x USB 2.0 ports and 4x SATA 3.0 ports.

KitGuru says: Although Intel hasn’t yet detailed the remaining 600-series motherboards, these specifications sure look plausible. Assuming they are correct, they should be significantly cheaper than current Z690 offerings. Will you be upgrading to Intel 12th Gen once cheaper motherboards hit the market? 

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