Tag Archives: Intel 20A

Intel Innovation 2023 officially kicked off today, with media, analysts and Intel partners gathering from around the world. As always, the event started with a keynote from none other than Pat Gelsinger, Intel CEO. The running theme this year is undoubtedly AI, with Intel positioning itself to be a key leader in this rapidly growing computing segment. Specifically, Intel wants to enable developers with the tools to create locally run AI applications, enhancing user privacy and paving the road for AI enhancements for all kinds of use cases.

We recently covered Intel's claim that it would deliver five fabrication nodes in four years which would allow the chip giant to regain its process technology leadership, presumably from TSMC, by 2025. These are bold claims that were immediately challenged by news that Intel would ditch its own 20A process in Arrow Lake and would instead use the TSMC N3 process...

Today Intel is unveiling its latest innovation – PowerVia, a new power delivery method set to debut on the Intel 20A process node in 2024. This marks Intel as the first in the industry to implement backside power delivery on a product-like test chip.  Speaking on PowerVia, Ben Sell, Intel …

We had big news from Intel this week, with the company unveiling its new process node roadmap and outlining plans to regain the process performance leadership crown by 2025. We've heard from Intel, now let's see what Leo thinks...

Today Intel has revealed its roadmap of process and packaging improvements, which will power the next several generations of Intel CPUs leading up to 2025 and beyond. This includes Intel's first new transistor architecture in more than a decade.