Intel Corp. plans to release a rather broad range of microprocessors based on the Skylake micro-architecture for mobile computers next year, according to a new media report. The upcoming central processing units (CPUs) will address all kinds of mobile devices, including tablets, 2-in-1s, mainstream notebooks as well as high-performance laptops.
As expected, the family of mobile central processing units powered by the Skylake micro-architecture will include three major lines: Skylake-Y for ultra-low-power devices, Skylake-U for mainstream notebooks and Skylake-H for high-end workstation- or gaming-class laptops. Each line will include from four to 15 models, which means that there will be at least 19 different mobile Skylake CPUs net year (four SKL-Y + four SKL-H + 15 SKL-U), reports CPU World.
General specifications of the new chips will look as follows:
- Skylake-Y (SKL-Y): Core M product line. The chips will feature 2 cores with Hyper-Threading, GT2-class graphics, on-package core-logic set, 3MB or 4MB cache, vPro and TurboBoost technologies. TDP: 4W or lower.
- Skylake-U (SKL-U): Core i7, Core i5, Core i3, Pentium and Celeron product lines. The chips will feature 2 cores with or without Hyper-Threading, GT1/GT2/GT3/GT3e-class graphics, on-package core-logic set, 2MB, 3MB or 4MB cache, vPro and TurboBoost technologies (on select models). TDP: 15W or 28W.
- Skylake-H (SKL-H): Core i7, Core i5, Core i3 product lines. The chips will feature 4 cores with Hyper-Threading (Core i3 will feature 2 cores), GT3/GT4-class graphics with or without embedded cache, large L3 caches, vPro and TurboBoost technologies (on select models). TDP: 35W or 45W.
Note: It is unclear which chips support DDR3/DDR3L/LPDDR3 and which also support DDR4.
The broad family of mobile Skylake microprocessors indicates that Intel plans to ramp up production of Skylake chips pretty quickly and therefore there will be a lot of systems featuring the latest processors in 2015. Unfortunately, there are no launch details or launch dates for Skylake CPUs.
Central processing units based on Intel’s Skylake micro-architecture are expected to feature considerably improved graphics, a bunch of special-purpose accelerators (e.g., HEVC and VP9 hardware decoders) and support such technologies as AVX 3.2 (512-bit instructions), SHA extensions (SHA-1 and SHA-256, secure hash algorithms), MPX (memory protection extensions), ADX (multi-precision add-carry instruction extensions) and other innovations.
The next-gen Skylake client platform due in 2015 will also be accompanied with numerous connectivity and I/O options, such as Snowfield Peak (Wi-Fi, Bluetooth), Douglas Peak (WiGig, Wi-Fi, Bluetooth), Pine Peak (WiGig), Alpine Ridge (Thunderbolt 3.0 with 40Gb/s transfer rate), Jacksonville Ethernet, next-generation XMM726x-series WWAN 4G/LTE modem and so on. Mobile platforms based on Skylake will support Rezence wireless charging.
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KitGuru Says: If the information is correct, then the roll-out of Skylake will be considerably faster than the roll-out of Broadwell. While we cannot say it for sure, but it looks like Broadwell chips will not have a long life on the market.