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Search Results for: CES 2019

X670 chipset might be outsourced, arriving in late 2020

The next-generation X670 chipset from AMD will be produced by a third-party, according to insider sources. These same sources also revealed that X670 would release in late 2020, alongside the 7nm+ Ryzen 4000 CPUs. The current X570 platform is manufactured in-house, by AMD, unlike the previous 300-series and 400-series motherboards. …

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Samsung receives industry’s first Carbon Footprint and Water Footprint certifications

Samsung has become the first tech company to receive global recognition for environmental sustainability of its semiconductor solutions with its 512GB eUFS 3.0 memory, earning the Carbon Footprint and Water footprint certifications. The company announced its 512GB embedded Universal Flash Storage 3.0 has been awarded Carbon Footprint and Water Footprint …

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