Tag Archives: PCI Express 3.0

The PCI SIG has been developing external PCI Express interconnection for over three years now, but only later this year the organization will finalize the specification of the technology. The new cable will compete against Intel’s Thunderbolt 3. While the tech makes a lot of sense for various devices, it …

Next year Advanced Micro Devices plans to introduce not only all-new accelerated processing units and central processing units, but also fresh platforms for client PCs. While AMD will do a lot to unify its next-gen platforms, there will still be major differences between systems powered by different microprocessors. AMD’s client …

G.Skill, a leading maker of dynamic random access memory (DRAM) modules for enthusiasts, has unveiled its first 3.40GHz DDR4 memory chips. While the company is not the first to announce 3.40GHz DDR4 solutions, it will be the first to actually ship appropriate DDR4 memory modules in volume. G.Skill’s Ripjaws 4 …

Later this year Intel Corp. plans to introduce its new code-named “Skylake” microprocessors that will target mass market segments and will support DDR4 memory. As a result, the latter will gain market share. Nonetheless, DDR4 will remain more expensive than DDR3 in the coming quarters, according to Micron Technology. At …

Samsung Electronics announced this week that it has begun mass production of its SM951 solid-state drive. The new SSD uses M.2 form-factor and PCI Express 3.0 interface to deliver massive performance improvement over the vast majority of consumer-grade solid-state drives available today. Unfortunately, it is unclear whether Samsung’s SM951 will …

Toshiba Corp. has introduced the industry’s first single-package solid-state drive with the PCI Express 3.0 interface. The tiny chip will enable considerably higher storage performance on embedded devices or a massive reduction of size and weight of PC storage. To take advantage of the new product, mobile application processors will …

Intel Corp. has reconsidered the launch schedule of its next-generation microprocessors code-named “Broadwell” and further delayed not only mainstream mobile parts, but also the high-end desktop and notebook models. Based on the new plan, the company may introduce the new Core i-series microprocessors only in July, or even September, 2015. …

A desktop platform roadmap that Intel Corp. had reportedly demonstrated at a conference in Italy has been published by an unofficial source. A slide from the roadmap confirms that Intel intends to release both code-named “Broadwell” and “Skylake” microprocessors for desktops next year. In addition, the company intends to release …

Sometimes mainboard makers come up with rather interesting solutions that truly leap performance of desktop personal computers forward by overcoming limitations of mainstream PC platforms. Unfortunately, in many cases elimination of one bottleneck just leads to creation of another… In a bid to boost performance of solid-state drives, Intel Corp. …

As previously reported, despite of the delay of the code-named Broadwell lineup of central processing units, Intel Corp.’s code-named Skylake chips are on-track to be introduced in 2015. Since preparations for introduction of the new platform are already underway in south-east Asia, the first leaks about the Skylake and systems …