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Tag Archives: TSV

AMD started to work on HBM technology nearly a decade ago

The high-bandwidth memory (HBM) introduced along with AMD’s code-named “Fiji” graphics processing unit radically changes the way graphics adapters are built and also dramatically improves potential performance of future graphics processing units. But while HBM looks ingeniously simple on paper, it was extremely hard to develop and is not easy …

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SK Hynix begins to produce 3D NAND flash memory

SK Hynix has begun to produce 3D NAND flash memory, which will be used for solid-state drives later this year. The vertically-stacked NAND flash memory from SK Hynix will improve performance and reliability of the company’s solid-state drives. The 3D NAND memory device that SK Hynix produces in volume features …

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Samsung begins to produce 64GB DDR4 modules based on TSV chips

Samsung Electronics on Tuesday said that has started to produce 64GB DDR4 memory modules that are powered by DDR4 memory chips that feature three dimensional (3D) “through silicon via” (TSV) package technology. The DRAM [dynamic random access memory] modules are designed for enterprise servers. Samsung’s 64GB registered dual inline memory …

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