Home / Tag Archives: chip production (page 3)

Tag Archives: chip production

TSMC builds world’s first 32-core networking chip using 16nm FinFET process technology

Taiwan Semiconductor Manufacturing Co. on Thursday said that it has built the world’s first many-core networking processor for next-generation wireless communications and routers using 16nm FinFET fabrication technology. The ultra-thin manufacturing process will allow the many-core chip to deliver high performance and rich feature-set while consuming low amounts of power. …

Read More »

Intel to spend $6 billion on 10nm fab in Israel

The Israeli government announced this week that it has approved a plan submitted by Intel Corp. regarding upgrading its fab in Kiryat Gat. Under the terms of the plan the chip giant intends to significantly modernize its semiconductor manufacturing facility in order to build chips using 10nm process technology there. Intel …

Read More »

Fujitsu and UMC to form chip production joint venture

Fujitsu Limited and United Microelectronics Corp. plan to form a joint venture that will operate Fujitsu’s semiconductor manufacturing complex in Mie prefecture in Japan. While initially Fujitsu will hold the control stake of the new company, it is going to gradually reduce it. The Japanese conglomerate has been winding down …

Read More »

TSMC to speed up development of 10nm process technology

In a bid to retain its leadership position on the market of contract semiconductor manufacturing, Taiwan Semiconductor Manufacturing Co. is reportedly accelerating development of its 10nm FinFET process technology. At present TSMC is the leading contract maker of chips produced using 28nm process technology. It is believed that the company makes considerably …

Read More »

Intel’s Custom Foundry division to make chips for Panasonic

Intel Corp. on Monday announced that it has entered into a manufacturing agreement with Panasonic Corp. The world’s largest chipmaker will produce Panasonic’s next-generation system-on-chips using 14nm low-power manufacturing process. Panasonic’s future SoCs will target audio visual-based equipment markets (TVs, Blu-ray players, media players, etc.), and will enable higher levels of …

Read More »

SMIC to produce 28nm chips for Qualcomm in China

Semiconductor Manufacturing International Corp. (SMIC), a China-based contract maker of chips, and Qualcomm on Thursday announced that SMIC will produce Qualcomm’s Snapdragon system-on-chips for mobile devices using 28nm process technology in China. The move will help Qualcomm to boost production of its advanced SoCs and lower their manufacturing costs. As …

Read More »