Tag Archives: semiconductor manufacturing

The Israeli government announced this week that it has approved a plan submitted by Intel Corp. regarding upgrading its fab in Kiryat Gat. Under the terms of the plan the chip giant intends to significantly modernize its semiconductor manufacturing facility in order to build chips using 10nm process technology there. Intel …

Although Intel Corp. imagines its future many years down the road and has a solid vision, it admits that going forward it will be much harder to achieve certain goals as manufacturing technologies get much more complex. Like other huge companies, Intel Corp. has big plans for the future. Recently …

Intel Corp. officially confirmed on Wednesday that it will not use extreme ultraviolet (EUV) lithography for its 10nm process technology allegedly due to come online in 2016. Apparently, not only the EUV scanners are not ready, but backbones of certain fabs may not support the new equipment due to its …

Taiwan Semiconductor Manufacturing Co. is on-track to start volume production of chips in the first quarter of 2015, according to a media report. The first client to order 16nm chips from TSMC is expected to be Apple, which is a little bit surprising. TSMC has been making test chips using …

As reported, the deal between International Business Machines Corp. and GlobalFoundries over chip manufacturing assets of the former has failed to materialize because the latter did not want to pay enough to the former. However, according to a new report, it was IBM, who was offering money to GlobalFoundries to take …

International Business Machines Corp. and GlobalFoundries have ended negotiations regarding acquisition of IBM’s semiconductor manufacturing assets by the contract maker of chips. The two companies failed to agree on the price, according to a media report. Earlier this year it was reported that IBM wanted $2 billion for its money-losing …

Fujitsu Limited and United Microelectronics Corp. plan to form a joint venture that will operate Fujitsu’s semiconductor manufacturing complex in Mie prefecture in Japan. While initially Fujitsu will hold the control stake of the new company, it is going to gradually reduce it. The Japanese conglomerate has been winding down …

Taiwan Semiconductor Manufacturing Co. said this week that it had begun to ship the first wafers processed using its 20nm fabrication technology to customers. The company began mass production of chips using 20nm manufacturing process in early January, the first commercial wafers were shipped to undisclosed customers in June. The …

In a bid to retain its leadership position on the market of contract semiconductor manufacturing, Taiwan Semiconductor Manufacturing Co. is reportedly accelerating development of its 10nm FinFET process technology. At present TSMC is the leading contract maker of chips produced using 28nm process technology. It is believed that the company makes considerably …

Intel Corp. on Monday announced that it has entered into a manufacturing agreement with Panasonic Corp. The world’s largest chipmaker will produce Panasonic’s next-generation system-on-chips using 14nm low-power manufacturing process. Panasonic's future SoCs will target audio visual-based equipment markets (TVs, Blu-ray players, media players, etc.), and will enable higher levels of …

In a bid to better compete against Taiwan Semiconductor Manufacturing Co. Samsung Semiconductor and GlobalFoundries earlier this year agreed to unify one of their 14nm process technologies and offer their foundry services collaboratively. Apparently, the tactics has worked out and the two companies recently landed orders to make chips using the …

GlobalFoundries, one of the world’s top contract makers of semiconductors, said this week it will upgrade one of its 200mm semiconductor production facilities in Singapore. The move will help the company to expand production capacities and increase output of chips made using advanced fabrication technologies. Although GlobalFoundries is one of …

Taiwan Semiconductor Manufacturing Co. has extended lead time for production of chips using 28nm process technology from ten to 16 weeks recently, a media report reads. The company reportedly claimed that the demand for 28nm manufacturing process is very high and therefore orders placed in May would take more time …

Taiwan Semiconductor Manufacturing Co. this week unveiled an improved version of its 16nm FinFET process technology that will hit volume production in 2015. In addition, the company revealed some details regarding its 10nm FinFET fabrication process and said that it would start risk production using the technology in Q4 2015, …

Early last year Intel Corp. demonstrated the world’s first fully-patterned 450mm wafers and in mid-2013 started to construct D1X module 2 fab, which is supposed to act as a primary development facility for virtually all of Intel’s 450mm initiatives. It was expected that commercial production of chips on 450mm wafers …