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Tag Archives: arm

The European Union prepares its own prototype CPU

As the UK prepares to officially leave the European Union this Friday (31st January), the European Processor Initiative (EPI) is priming the first prototype of its HPC processor designed for advanced computing applications. The EPI was set up by the European Commission as part of the Framework Partnership Agreement, with …

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TSMC and ARM showcase first 7nm chiplet system for HPC

ARM and TSMC have announced their co-developed silicon-proven chiplet system based on multiple ARM cores, using TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging solution, which is heralded as an industry first based on the 7nm FinFET process. The proof-of-concept chip comprises of a dual-chiplet CoWoS implemented in 7nm. Each chiplet contains four ARM …

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ARM encourages orders for 1 trillion processors

What started as an ambitious project by the BBC to put computers into UK schools in 1981, ended with ARM dominating several global markets for microprocessors – including mobile phone giants Apple, Samsung and Huawei. Owned by Japan’s SoftBank, but still headquartered in Cambridge, the company is dedicated to being …

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Japanese firm Softbank, will purchase ARM for £24 billion

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One of the biggest technological deals in the UK’s history is set to take place later this year, after it was agreed that Japanese telecoms company, Softbank, will purchase ARM Holdings for £24.3 billion. Although it still needs shareholder approval, the buyout would overvalue stock by more than 43 percent. …

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Qualcomm sampling 24-core ARM processor for servers

Qualcomm has started to sample a new 24-core ARM processor aimed for use in servers and data centres, the company has revealed. The new chip in question is a pre-production system on chip (SoC) based on the ARMv8-A instruction set, which will be purposed for tackling common data centre workloads and …

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Intel buys assets of Via Telecom

Via Technologies, a developer of low-cost computer platforms, has announced that it had sold part of its telecommunication assets to Intel Corp. The two companies revealed no details about the deal, but it looks like Intel got various patents related to telecommunication technologies. Via Technologies and Intel reached agreement on …

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Xilinx starts to ship 16nm FinFET+ chip ahead of schedule

Xilinx, a leading maker of programmable gate arrays as well as special-purpose system-on-chip solutions, this week said that it had made the first customer shipment of its Zynq UltraScale+ processing solution. The chip is made using Taiwan Semiconductor Manufacturing Co.’s second-generation 16nm FinFET process technology (CLN16FF+) with increased performance and …

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Valve: DirectX 12 does not make a lot of sense, Vulkan does

Microsoft Corp.’s DirectX 12 application programming interface promises to significantly improve performance of video games in Windows 10 operating system thanks to efficient usage of modern hardware. However, Valve Software believes that it makes no sense to use DX12, but to utilize cross-platform Vulkan API instead. Modern application programming interfaces – …

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AMD begins development of its third major semi-custom design

Advanced Micro Devices recently started to design its third semi-custom accelerated processing unit for an undisclosed customer. Some believe that this third semi-custom system-on-chip will eventually power Nintendo’s next-generation game console code-named “NX”. However, AMD claims that the new SoC “expands the base” of its semi-custom business beyond gaming, which …

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AMD vows to keep R&D investments at appropriate levels

Despite of tough times, Advanced Micro Devices plans to sustain its research and development investments on certain levels in a bid to ensure that its products are competitive in the future. Research and development are two corner stones of high-tech companies. Without fundamental research of things that may not seem important today …

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Xilinx tapes-out world’s first 16nm FinFET+ system-on-chip

Xilinx, a leading designer of field-programmable gate arrays as well as special-purpose system-on-chip solutions, on Wednesday said that it had taped-out one of the world’s first SoCs to be made using TSMC’s 16nm FinFET+ process technology. The new chip will be used for self-driving vehicles, industrial Internet-of-Things and 5G wireless …

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