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Intel EMIB silicon helps chips talk to each other

Many of today’s devices including smartphones, computers and servers contain multiple smaller chips sealed inside a larger, usually rectangular package, communicating with each other via a complex multi-layered piece of silicon no bigger than a grain of rice. In the case of Intel powered devices, this communication between chips including …

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Intel releases the new SSD 665p series

Intel has launched its second generation QLC 3D NAND SSDs, succeeding the 660p series with the 665p series. The new Intel SSD 665p series is the “first 96-layer QLC-based PCIe SSD” to be manufactured. The 665p series comes with in a 1TB or 2TB capacity, offering “great value for everyday …

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Lian Li announce the Lancool II case

Lian Li has announced an update to its Lancool chassis series. The Lian Li Lancool II is a revised and improved version of the original Lancool One. The new case is available in either black or white and is packed with features to improve the PC building experience. Easy access …

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