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Asus reveals its liquid metal thermal compound application process

One of the greatest challenges manufacturers face when creating powerful gaming laptops is keeping the device cool during intensive workloads. With their high-performance processors and GPUs, gaming laptops emit heat that can be difficult to control and when the temperature rises, core frequencies automatically lower to prevent damage which affects …

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InWin introduce a new 216 mid-tower chassis

InWin has rolled out a new mid-tower PC case this week that features an understated yet premium looking appearance. The InWin 216 is equipped with brushed aluminium front panel accents and space inside for installation of motherboards up to E-ATX format. The bulk of the InWin 216 design is made …

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Micron prepares for mass production of 128-layer 3D NAND

Micron produces a variety of memory, whether it is for mobile devices, gaming desktops or industrial grade microSD cards. Now the company is looking to step up its production of the next generation of 3D NAND memory – which includes replacement gate (RG) technology and up to 128 layers. The reports are based …

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Folding@Home reaches one exaFLOP

It hasn't even been a full week since Folding@Home announced that it had reached 470 petaFLOPs of computing power – more than the 7 most powerful supercomputers in the world, combined. Now the project originating from Stanford University has reached another milestone: one exaFLOP. Try to let that sink in a …

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