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Tag Archives: soc

Qualcomm begins showing off the Snapdragon 820

Qualcomm has officially began showing off the Snapdragon 820 SoC, which will likely appear in many of next year's flagship Android smartphones. The chip succeeds from the Snapdragon 810, which was criticised for its poor heat management and power draw. This time around, Qualcomm has focussed on this area a …

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Qualcomm may use 10nm process for Snapdragon 830

It looks like Qualcomm may be moving on to the 10nm manufacturing process for its future flagship system on chip, the Snapdragon 830. Right now, most flagship devices are using the Snapdragon 810, which had a few issues. However, Qualcomm recently unveiled the Snapdragon 820, which aims to be in …

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Qualcomm sampling 24-core ARM processor for servers

Qualcomm has started to sample a new 24-core ARM processor aimed for use in servers and data centres, the company has revealed. The new chip in question is a pre-production system on chip (SoC) based on the ARMv8-A instruction set, which will be purposed for tackling common data centre workloads and …

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Apple downplays iPhone 6s A9 chip power draw concerns

Yesterday news spread that one version of the iPhone 6s seemingly greatly outperforms the other. The A9 chip inside of the new iPhone could be manufactured by either TSMC or Samsung, with the former's version expanding battery life by as much as 20 per cent. This news has since reached …

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Xilinx starts to ship 16nm FinFET+ chip ahead of schedule

Xilinx, a leading maker of programmable gate arrays as well as special-purpose system-on-chip solutions, this week said that it had made the first customer shipment of its Zynq UltraScale+ processing solution. The chip is made using Taiwan Semiconductor Manufacturing Co.’s second-generation 16nm FinFET process technology (CLN16FF+) with increased performance and …

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Qualcomm cuts jobs, may break itself up

Qualcomm has been one of the more disruptive companies in the technological industry over the past few years, with its chips beating AMD and Intel to the punch in many mobile scenarios. However that may not be the case in the future, as the American firm has announced that it's …

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Xilinx tapes-out world’s first 16nm FinFET+ system-on-chip

Xilinx, a leading designer of field-programmable gate arrays as well as special-purpose system-on-chip solutions, on Wednesday said that it had taped-out one of the world’s first SoCs to be made using TSMC’s 16nm FinFET+ process technology. The new chip will be used for self-driving vehicles, industrial Internet-of-Things and 5G wireless …

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Nvidia: We’ve learnt a lot from the automotive industry

Nvidia Corp. is one of the world’s most successful developers of graphics processors ever, but the company is constantly searching for new markets for itself. Cars nowadays require a lot of general-purpose processing horsepower and visual processing capabilities, something that Nvidia can deliver thanks to its expertise in GPUs and …

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Intel’s Curie, the tiny SoC that can

Intel Curie

Intel's announced it's new SoC (system-on-chip) for wearable devices today at CES. Scheduled for release in the second half of 2015 this tiny all in one system will be able to fit just about anywhere, with it being around the same size as your thumbnail. Intel have also revealed plans with several …

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Nvidia Tegra X1 to power in-car display technology

There's been a lot of talk about the next-generation of in-car infotainment systems in recent months, with both Google and Apple once again going head to head to see who can dominate with their respective Android Auto and CarPlay systems. However it may be Nvidia that really drives forward the …

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AMD: Chips for tablets are not our priority

Although Advanced Micro Devices has developed several generations of chips for tablet PCs, it has not shipped a lot of them because makers of tablets were not too interested in making slates based on x86 processors and Microsoft Windows operating system. As a result, AMD now believes that chips for tablets are …

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Intel and Altera to co-develop 14nm multi-die devices

Intel Corp. and Altera this week said they would extend their collaboration to the development of multi-die devices that leverage Intel's world-class package and assembly capabilities. The multi-die devices will feature Altera's Stratix 10 FPGAs and SoCs made using 14nm process technology as well as other components. This will allow …

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