The increasingly widespread application of DDR4 on mainstream platforms has helped to drive the memory technology's production rates upwards with pricing travelling in the opposite direction. A 32GB quad-channel kit of no-nonsense DDR4 memory can now be considered affordable by a greater audience who may have advanced workloads that consume …
Read More »AMD begins to sell DDR4 memory modules for Intel and next-gen platforms
Advanced Micro Devices has started to sell Radeon DDR4 memory modules. The new DIMMs are not compatible with AMD’s existing platforms, but can work with Intel Corp.’s central processing units as well as AMD’s upcoming chips due in 2016. AMD Radeon R7 DDR4 memory modules are available in dual-channel 8GB …
Read More »Micron to start sales of SSDs based on TLC NAND this quarter
Micron Technology plans to finally start shipments of consumer solid-state drives based on triple-level cell (TLC) NAND flash in the ongoing quarter, the company revealed this week. SSDs featuring TLC NAND memory will be generally more affordable than non-volatile storage solutions powered by multi-level cell (MLC) flash. “We will begin shipping …
Read More »Prices of DDR3 and DDR4 continue to drop, set to decline further
Contract prices of dynamic random access memory (DRAM) modules dropped in August and September, despite peak season and anticipated stock-up demand on China, according to DRAMeXchange. Analysts believe that the launch of Microsoft Windows 10 this summer did not catalyse rise of demand, whereas the free Windows 10 upgrade program …
Read More »Samsung: NAND flash industry will triple output to 253EB by 2020
Samsung Electronics predicts that the NAND flash industry will triple output of non-volatile memory over the next five years and will produce whopping 253 exabytes of NAND in 2020. Although the increase is impressive, total output of flash memory will account for less than 10 per cent of storage capacity …
Read More »Intel: Usage of DDR3 at default voltages can damage “Skylake”
Intel Corp.’s latest “Skylake” processors officially support only DDR3L and DDR4 memory, but there are motherboards for the new chips that can also use DDR3. While the chips can work with previous-gen memory, prolonged usage of such dynamic random access memory (DRAM) can damage microprocessors, according to Intel. DDR4 memory …
Read More »G.Skill readies Trident Z DDR4 modules with 4.40GHz clock-rate
G.Skill is working on new Trident Z memory modules, which will hit unbelievable 4.40GHz frequency. The modules are designed for extreme enthusiasts and will be compatible with select Intel Z170-based platforms for overclockers. G.Skill’s Trident Z DDR4-4400 (PC4-35200) memory modules will feature 4GB capacity and will be based on hand-selected …
Read More »OcUK ‘8Pack Approved’ kit includes Intel Core i7-6700K@4.50GHz, other hardware
Overclockers UK has unveiled its new “Elite Tier Skylake” “8Pack Approved” hardware bundle that not only lets to build a high-end system at a discount price, but also includes Intel Core i7-6700K “Skylake” processors that are guaranteed to run at increased clock-rates. A lot of people enjoy overclocking. Modern central …
Read More »Apacer unveils 64GB 3GHz DDR4 SO-DIMM memory kit for laptops
Apacer on Tuesday unveiled a lineup of new DDR4 SO-DIMM memory kits for high-performance laptops. The new kits have up to 64GB capacity and can operate at clock-rates of up to 3000MHz. The new modules are designed for Intel’s new mobile “Skylake” central processing units and high-end gaming and workstation …
Read More »Asrock unveils mainboard for ‘Skylake’ with DDR3 and DDR4 memory slots
Asrock has quietly unveiled a unique mainboard for Intel Corp.’s latest processors code-named “Skylake”, which features both DDR3 and DDR4 memory slots. The motherboard is an affordable platform, but it can be used to build rather high-performance personal computers for gaming. The Asrock B150M Combo-G mainboard for Intel “Skylake” processors in …
Read More »Samsung unveils the first 4.26GHz LPDDR4 chip with 12Gb capacity
Samsung Electronics has announced that it had begun mass production of LPDDR4 memory chips with 12Gb capacity. The new memory devices were designed for high-performance smartphones and tablets that require a lot of ultra-fast dynamic random access memory. Samsung’s 12Gb LPDDR4 memory chip not only features unprecedented capacity – 12Gb, …
Read More »Micron to unveil third-gen hybrid memory cube in 2016
Micron Technology is working on the third generation of its hybrid memory cube technology, which will be unveiled next year. If the third-gen HMC doubles data rate of the memory from 15Gb/s today, then the new memory technology will offer unprecedented bandwidth. HMC uses advanced through-silicon vias (TSVs) – vertical …
Read More »DDR4 memory gets 25% cheaper in three months
Slow demand for personal computers drives prices of dynamic random access memory (DRAM) down. Thanks to that, DDR4 memory is getting considerably cheaper than it was a year ago. In fact, DDR4 got 25 per cent less expensive in less than three months. According to DRAMeXchange, the world’s leading computer …
Read More »Samsung: Post-DDR4 memory to hit 6.40GHz, to arrive after 2020
The development of DDR4 began several years before DDR3 was commercialized and it took DDR4 about nine years to get from the drawing board into actual computers. Right now key industry players are already working on the standard, which will succeed DDR4. According to Samsung Electronics, prototypes of the new …
Read More »AMD: We are actively promoting HBM and do not collect royalties
Advanced Micro Devices is currently the only company to use high-bandwidth memory it co-developed with SK Hynix and other partners. While usage of HBM is clearly a competitive advantage that AMD has over its rivals, the company is encouraging others to use the new memory type and does not intend …
Read More »AMD started to work on HBM technology nearly a decade ago
The high-bandwidth memory (HBM) introduced along with AMD’s code-named “Fiji” graphics processing unit radically changes the way graphics adapters are built and also dramatically improves potential performance of future graphics processing units. But while HBM looks ingeniously simple on paper, it was extremely hard to develop and is not easy …
Read More »Intel: SSDs to gain presence in datacentres as capacities hit 100TB+
Nowadays datacentres use solid-state drives to store frequently used data, but continue to rely on hard disk drives to store occasionally accessed files. Intel Corp. believes that in five years’ time everything will change and SSDs will be used more broadly in datacentres. The chip giant forecasts that increasing capacities and …
Read More »Chairman of Tsinghua Unigroup visits the U.S. to discuss Micron bid
In a bid to re-start talks about possible acquisition of Micron Technology, Zhao Weiguo, the chairman of China-based Tsinghua Unigroup, this week visited the U.S. The results of his negotiations are unknown, but the visit clearly signals that the government-backed technology investment company considers Micron and computer memory technologies strategically …
Read More »Micron readies second-gen 3D XPoint, working on all-new memory tech
The first commercial solid-state drives based on the recently introduced 3D XPoint non-volatile storage-class memory are yet to hit the market, but Intel Corp. and Micron Technology Corp. are already working on the second-generation 3D XPoint technology. Moreover, Micron is also designing an all-new memory technology that will further close …
Read More »Intel: First 3D XPoint SSDs will feature up to 6GB/s of bandwidth
Although 3D XPoint – a new type of non-volatile memory jointly developed by Intel Corp. and Micron Technology – promises to significantly improve performance of solid-state drives over time, do not expect it to revolutionize SSD landscape overnight. According to performance estimates released by Intel, performance of the first-gen 3D …
Read More »SK Hynix to spend nearly $26 billion on capacity expansion
SK Hynix, one of the leading manufacturers of NAND flash and the second largest maker of dynamic random access memory (DRAM), plans to spend 31 trillion won ($25.94 billion) to build two semiconductor production facilities in South Korea over the next 10 years. The expansion of production capacities will unlikely …
Read More »Samsung expects graphics cards with 6144-bit bus, 48GB of HBM memory onboard
Samsung Electronics indicated that it plans to start volume production of high-bandwidth memory (HBM) next year at the Intel Developer Forum this week. At the trade-show, the company revealed its current vision and expectations concerning HBM. Samsung foresees that eventually high-performance applications (such as GPUs) could feature up to six …
Read More »Intel: DDR4 will dominate PCs and servers next year
Development of DDR4 dynamic random access memory took a long time. However, adoption of the new DRAM will be rather quick. Already next year the majority of servers and personal computers will rely on DDR4. The DDR4 memory standard is currently supported by Intel Corp.’s server platforms as well as …
Read More »G.Skill demonstrates 4133MHz and 4266MHz memory modules at IDF
G.Skill this week is demonstrating its upcoming DDR4 dual-channel memory kits that can run at clock-rates higher than 4GHz at the Intel Developer Forum. The company intends to start selling such products in the coming months or weeks. G.Skill is working on Trident Z-series 8GB dual-channel DDR4 memory kits that …
Read More »Overclocker hits 4.90GHz frequency with a DDR4 module
The 5GHz frequency milestone for computer memory is yet to be achieved, but professional overclockers are probably not far from hitting it. This week Chi-Kui Lam, a well-known computer tweaker, managed to push a DDR4 memory module from G.Skill to whopping 4.90GHz. Chi-Kui Lam overclocked a 4GB G.Skill Ripjaws 4 …
Read More »Corsair demos 4GHz DDR4 memory modules at IDF
It was a matter of time before off-the-shelf DDR4 memory managed to hit 4000MHz milestone. At present, only G.Skill offers 4GHz memory modules commercially, but other makers are gearing up to release their kits with unprecedented clock-rate. Corsair is showcasing such modules at the Intel Developer Forum. At the IDF, …
Read More »Rambus unveils its first R+ chips for server memory modules
Throughout its history, Rambus has received royalties from other makers of chips for its patents. However, on Monday the company introduced its own ICs designed to improve server-class memory modules. The company will sell the products to interested parties itself. The first in a family of R+ chips, the RB26 …
Read More »DDR4 memory hits 4838MHz with LN2 cooling, Gigabyte Z170X-SOC Force mainboard
A professional overclocker this week set a new clock-rate record for DDR4 memory. This time a memory module from G.Skill was overclocked to whopping 4838MHz on Gigabyte Technology’s Z170X-SOC Force mainboard. Hicookie, a professional overclocker from Taiwan who works with Gigabyte Technology, this week pushed a 4GB G.Skill memory module …
Read More »Samsung’s new SSDs feature up to 6.4TB capacity, up to 5.5GB/s bandwidth
Samsung Electronics has introduced its all-new solid-state drives based on the latest TLC 3D V-NAND flash memory for enterprises. The SSDs provide unprecedented levels of performance, capacity, endurance and reliability, which will help Samsung to address new markets. The new enterprise-class SSDs are based on Samsung’s latest 48-layer 3D V-NAND …
Read More »Samsung begins to produce 48-layer 3D V-NAND flash memory
Samsung Electronics on Tuesday said that it had started to mass produce the world’s first triple-level-cell (TLC) three dimensional vertical NAND flash memory chips with 256Gb capacity. The new 3D V-NAND memory ICs [integrated circuits] will help Samsung to make solid-state drives and other flash-based devices more affordable, which will …
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