Home / Component (page 359)

Component

Rambus joins JEDEC committee to co-develop next-gen server memory

History always repeats itself. Rambus and JEDEC have a history that began in the early nineties and greatly influenced the whole dynamic random access memory (DRAM) industry in the 2000s and 2010s. That history is about to repeat itself. Rambus, a developer of high-speed interfaces and owner of multiple standard-essential …

Read More »

Phanteks Enthoo Pro Review

Last summer Phanteks won our hearts with the Enthoo Primo aluminium case – which claimed a ‘Must Have' award despite a price tag of £199.99. This success led to a huge amount of anticipation for the upcoming Phanteks Enthoo Pro as we were promised a case that carried over the …

Read More »

SanDisk unveils its first fully-encrypted solid-state drives

SanDisk Corp. on Tuesday announced its first family of solid-state drives that support all the certified encryption technologies. The new drives are designed for corporate laptops, so expect to see them in the upcoming Lenovo ThinkPads and HP EliteBooks. The drives will be made in 2.5”/7mm and M.2 versions. The …

Read More »

Intel officially rolls-out Z97 and H97 chipsets

Intel Corp. has officially unveiled its latest core-logic sets for desktop computers, the Z97 and H97. The new chips support all existing microprocessors in LGA1150 packaging that belong to the Haswell and Haswell Refresh families as well as the upcoming code-named Broadwell central processing units. The fresh platforms do not …

Read More »

YOYOTech launches Warbird Z7

As you'd expect, with the advent of a new Intel chipset, every major computer brand is pushing through new ranges of systems that promise to be better, faster and more feature-rich than anything you've seen before. KitGuru casts an eye over the interwibble and picks out one such newbie. We …

Read More »

Samsung begins to mass produce 3D V-NAND flash in China

Samsung Electronics, one of the world’s top makers of NAND flash memory, last week announced that its new memory fab in Xi’an China has begun full-scale manufacturing operations. The new facility will produce Samsung’s advanced NAND flash memory chips, such as 3D V-NAND. Vertical NAND (V-NAND) memory stacks memory cells …

Read More »

Intel finalizes specs of Core i “Devil’s Canyon” chips

A Chinese web-site has revealed the final specifications of Intel Corp.’s Core i-series “Devil’s Canyon” microprocessors that promise to offer better overclockability than existing chips based on the Haswell micro-architecture. As it appears, in addition to higher overclocking potential, the new flagship LGA1150 chip will offer very high performance out-of-the-box …

Read More »

VESA adds Adaptive Sync technology to DisplayPort standard

The Video Electronics Standards Association (VESA) on Monday announced that the future implementations of the DisplayPort 1.2a standards will feature Adaptive Sync technology that is supposed to synchronize refresh rates of displays with actual frame-rate that is displayed. The feature will make games and video run much smoother than currently. …

Read More »

Intel’s Broadwell processors to receive a graphics core upgrade

Although it has long been expected that the code-named Broadwell family of microprocessors from Intel Corp. would feature an improved graphics processing unit, it looks like the upgrade may be more significant than previously thought. Apparently, the new graphics and multimedia engine would not only feature higher performance, but also …

Read More »

Intel Skylake PC platform: quad-core CPUs, new graphics, new chipsets

As previously reported, despite of the delay of the code-named Broadwell lineup of central processing units, Intel Corp.’s code-named Skylake chips are on-track to be introduced in 2015. Since preparations for introduction of the new platform are already underway in south-east Asia, the first leaks about the Skylake and systems …

Read More »