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Tag Archives: 3D NAND

SK Hynix introduces 72-layer 3D NAND

There has been a lot of innovation in the memory market recently. First Intel launched its 3D XPoint technology and now, SK Hynix is introducing the industry's first 72-layer 256 gigabit 3D NAND flash based on TLC arrays. By moving up to 72-layers, SK Hynix is able to stack 1.5 …

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Toshiba doubles down on 3D memory investment with new fab

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Toshiba is set to build a brand new fabrication plant in Yokkaichi Operations in Mie, Japan, dedicated to the production of 3D Flash memory. With construction set to begin in early 2017, the fab. will sit alongside a new Memory research and development centre that will also be constructed over …

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Intel shows off new SSDs, first with 3D NAND

Intel is launching a new line of SSDs today, the first from the company to feature 3D NAND chips. These super fast new drives were first announced last year, promising a new level of performance at capacities of up to 2TB and now, it looks like they are ready to …

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Samsung plans to release 4TB SSDs in early 2016

Samsung Electronics is working on a new solid-state drive with 4TB capacity. The SSD will be available in early 2016, but its performance and pricing are yet unknown. Samsung 850 Pro solid-state drive with 4TB capacity will be based on the company’s third-generation 48-layer 3D V-NAND memory, reports AnandTech. While …

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Samsung unveils 950 Pro SSDs with up to 2.5GB/s read speeds

Samsung Electronics has introduced its new family of solid-state drives that offer extreme performance and moderate pricing. The new SSDs come in M.2 form-factor, fully support NVMe protocol and use the company’s second-generation 3D V-NAND flash memory. The Samsung 950 Pro-series solid-state drives are based on the second generation MLC …

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Samsung begins to produce 48-layer 3D V-NAND flash memory

Samsung Electronics on Tuesday said that it had started to mass produce the world’s first triple-level-cell (TLC) three dimensional vertical NAND flash memory chips with 256Gb capacity. The new 3D V-NAND memory ICs [integrated circuits] will help Samsung to make solid-state drives and other flash-based devices more affordable, which will …

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Toshiba, SanDisk unveil 256Gb 48-layer BiCS NAND flash memory chip

Toshiba Corp. and SanDisk Corp. have formally introduced their first vertically stacked triple-level-cell (TLC) NAND flash memory IC [integrated circuit] with 256Gb capacity. The new 3D BiCS [bit cost scalable] NAND flash memory will be mass produced next year. Toshiba’s new 256Gb (32GB) 48-layer BiCS flash device features 3-bit-per-cell TLC (triple-level cell) …

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SK Hynix begins to produce 3D NAND flash memory

SK Hynix has begun to produce 3D NAND flash memory, which will be used for solid-state drives later this year. The vertically-stacked NAND flash memory from SK Hynix will improve performance and reliability of the company’s solid-state drives. The 3D NAND memory device that SK Hynix produces in volume features …

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Samsung announces 2TB solid-state drives for consumers

Solid-state drives have higher performance compared to hard disk drives, but when it comes to storage capacities HDDs are unrivalled. High-capacity SSDs are usually very expensive and are not considered as replacement for hard drives. However, Samsung on Monday introduced its new 850 Evo and 850 Pro solid-state drive that …

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Chillblast slashes prices of Samsung 850 Evo and 850 Pro SSDs

Chillblast, a well-known maker of enthusiast-class personal computers from the U.K., offers rather substantial discounts on Samsung Electronics’ 850 Evo and 850 Pro solid-state drives for a limited time. For less than two weeks, Samsung’s latest family of solid-state drives will be available with £10 – £50 discounts at Chillblast. …

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Toshiba’s 48-layer BiCS 3D NAND enables fast and reliable SSDs

Toshiba Corp. and SanDisk Corp. this week said that they have finished development of vertically-stacked 3D NAND memory devices. The BiCS [bit cost scalable] NAND flash memory from the two companies will be mass-produced in 2016 and will enable new solid-state storage devices with enhanced reliability and performance. Toshiba’s three-dimensional …

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