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Tag Archives: xeon

Intel unveils 18-core Xeon E7 v3 processors for heavy-duty servers

Intel Corp. has unveiled its new Xeon E7-8800/4800 v3 microprocessors designed for mission critical, real-time analytics, Big Data and in-memory applications. The new chips integrate up to 18 cores, feature all-new RAS [reliability, availability, serviceability] features and support a number of new technologies that greatly improve performance of specific applications. …

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Intel: We are excited about ‘Skylake’ processors and Windows 10

Slow demand for personal computers in the first half of the year substantially affected Intel Corp.’s business results, but the company remains moderately optimistic and believes that launches of its future microprocessors code-named “Skylake” as well as Microsoft Corp.’s Windows 10 operating system will help its PC business. Intel’s client …

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Benchmark results show notable architectural advantages of ‘Skylake’ processors

Intel Corp.’s code-named “Skylake” processors may be significantly faster than existing chips at the same clock-rate thanks to architectural improvements, according to performance benchmarks of alleged engineering sample of the forthcoming CPU. If Intel manages to maintain current clock-rates with commercial “Skylake” chips, the latter could be significantly faster than …

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SK Hynix to speed up its DDR4 memory chips this year

SK Hynix plans to introduce new versions of its DDR4 dynamic random access memory chips capable of operating at higher clock-rates compared to those available today. The new chips will boost performance of high-end and performance-mainstream PCs in the second half of this year. Nowadays SK Hynix, Samsung Electronics and …

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SK Hynix to mass produce 128GB DDR4 memory modules in Q4 2015

SK Hynix has notified its partners regarding availability of its high-capacity DDR4 memory modules for servers. A good news is that the company will improve performance of such memory solutions, however, a not very good news is that the firm will delay mass production of its flagship 128GB LRDIMM by …

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Intel: As AMD exited the server market, ARM chips get chances

At present Intel Corp. controls shipments of around 98 microprocessors for servers on the planet. Advanced Micro Devices is no longer a significant competitor for the chip giant, but a crowd of ARM-based chip developers seems to be. Server customers and makers need alternative processors to Intel Xeon, which is …

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Intel: First full-custom Xeon CPUs are due next year

The needs of modern cloud datacenters require developers of microprocessors to implement certain custom functionality into their products. As reported, Intel Corp. has incorporated multiple special-purpose technologies into its latest Xeon platform and offers optimized versions of CPUs to select customers. However, the company still does not offer chips that …

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G.Skill introduces 3.40GHz DDR4 memory modules

G.Skill, a leading maker of dynamic random access memory (DRAM) modules for enthusiasts, has unveiled its first 3.40GHz DDR4 memory chips. While the company is not the first to announce 3.40GHz DDR4 solutions, it will be the first to actually ship appropriate DDR4 memory modules in volume. G.Skill’s Ripjaws 4 …

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Micron: DDR4 will remain more expensive than DDR3 this year

Later this year Intel Corp. plans to introduce its new code-named “Skylake” microprocessors that will target mass market segments and will support DDR4 memory. As a result, the latter will gain market share. Nonetheless, DDR4 will remain more expensive than DDR3 in the coming quarters, according to Micron Technology. At …

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Overclockers UK introduces Renda frequency enhanced workstations

Professional graphics workstations are aimed at creative professionals who are supposed to generate beautiful visuals and inspiring designs. Ironically, virtually all workstations lack any creative touch themselves, whether it is about style or enhancements in terms of performance. Overclockers UK decided to change that with Renda family of workstations. The …

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Intel to describe its 18-core chip with 45MB cache in February

Intel Corp. will reveal technical details about its next-generation multi-core microprocessor for mission-critical servers next February at the 2015 IEEE international Solid-State Circuits Conference (ISSCC). The chip will be the most complex central processing unit ever made by Intel. Intel Xeon E7 v3 “Haswell-EX” microprocessor for servers with up to …

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Intel preps Broadwell- and Skylake-based Xeon E3 for 1P servers

Intel Corp. plans to release two new generations of Xeon central processing units for uniprocessor (UP) servers and workstations next year. The chips will be based on the code-named “Broadwell” and “Skylake” micro-architectures and are expected to feature improved performance, integrated graphics, power efficiency as well as memory controllers. Intel Xeon …

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Samsung begins to produce 8Gb DDR4 memory, 32GB DDR4 modules

Samsung Electronics has begun to produce 8Gb DDR4 memory chips. The new memory devices will power 32GB DDR4 modules and open the doors to 128GB DDR4 memory modules for high-end enterprise-class servers. The 8Gb DDR4 ICs are produced using 20nm fabrication process. Samsung’s 8Gb DDR4 memory chip can operate at …

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Intel: We have roughly 35 custom Xeon models in the lineup

Intel Corp. is gradually increasing the number of custom microprocessors designed for specific customers in its lineup. The move helps the company to maintain its market share and address clients that have special requirements and which otherwise would have chosen proprietary solutions from other companies. “The data center team is …

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Intel unveils new-generation Xeon E5 v3 chips with up to 18 cores

Intel Corp. on Monday rolled-out its new Xeon E5 2600/1600 v3 server processors based on the code-named “Haswell” micro-architecture. The latest server central processing units feature up to 18 cores per chip and quad-channel DDR4 memory controllers, whereas the new C612 platform code-named “Grantley” features a number of innovations that will be …

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Samsung begins to produce 64GB DDR4 modules based on TSV chips

Samsung Electronics on Tuesday said that has started to produce 64GB DDR4 memory modules that are powered by DDR4 memory chips that feature three dimensional (3D) “through silicon via” (TSV) package technology. The DRAM [dynamic random access memory] modules are designed for enterprise servers. Samsung’s 64GB registered dual inline memory …

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Intel details Xeon Phi ‘Knights Landing’ co-processor for HPC

At the International Supercomputing Conference in Leipzig, Germany, Intel Corp. unveiled additional details regarding its next-generation Xeon Phi co-processor code-named “Knights Landing.” As it appears, the KNL chip will not only offer breakthrough performance, but it will also provide breakthrough programmability thanks to the fact that it will feature modern …

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Intel could add customer-specific instructions to its Xeon chips

For several years now Intel Corp. has configured some of its Xeon processors in accordance with demands of its large customers, such as Amazon or Facebook. Earlier this year Intel agreed to install FPGAs [field programmable gate arrays] into the package of its Xeon central processing units in order to …

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Apple Mac Pro finally ships immediately after purchase

Apple has finally managed to solve the issues with availability of its high-end Mac Pro workstations. At present the systems can be purchased and obtained in several days. Previously it took Apple up to six weeks to ship its flagship desktops to their owners. Although the Apple Mac Pro was …

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