Tag Archives: DRAM

A Chinese web-site has published what it claims to be preliminary performance benchmarks of an upcoming high-performance graphics card from Advanced Micro Devices. Just like previous unofficial test results, the new ones indicate that AMD’s forthcoming high-end graphics solution will beat everything that is available on the market today except …

Rambus has announced that it is working on a new dynamic random access memory (DRAM) architecture that will shrink latencies and increase capacities of computer memory chips. The company did not reveal many details on the matter, but indicated that at least two major producers of DRAM are interested in …

A leading professional overclocker has managed to set a new DDR4 clock-rate record using hardware from MicroStar Interational, Kingston and Intel Corp. While overclocking results of contemporary DDR4 memory modules are impressive, when it comes to actual frequency, they are considerably behind DDR3 memory solutions. Toppc, one of the world’s …

Although Advanced Micro Devices officially told its investors and financial analysts not to expect any new graphics cards on the market before the second quarter of calendar 2015, many observers still expected AMD to announce a new single-chip flagship graphics solution in the Q1. However, a person with knowledge of …

Samsung Electronics may want to increase its share of the market of computer memory as it is planning to expand DRAM production capacity, a media report claims. The expansion will unlikely negatively affect prices of dynamic random access memory in the second half of the year, but the fact that …

Advanced Micro Devices yet has to reveal its new families of graphics processing units this year, but already now the code-name of AMD’s 2016 graphics products lineup is known. Apparently, the company will continue to use names of islands to call its next-generation chips. AMD’s next-generation family of Radeon GPUs …

G.Skill, a leading maker of dynamic random access memory (DRAM) modules for enthusiasts, has unveiled its first 3.40GHz DDR4 memory chips. While the company is not the first to announce 3.40GHz DDR4 solutions, it will be the first to actually ship appropriate DDR4 memory modules in volume. G.Skill’s Ripjaws 4 …

Two employees of Advanced Micro Devices have revealed in their LinkedIn profiles that they had worked on AMD Radeon R9 380X graphics processing units with vertically-stacked high bandwidth memory (HBM). The engineers at AMD essentially confirmed that the company’s next-generation flagship graphics processor will use HBM memory and will carry …

Later this year Intel Corp. plans to introduce its new code-named “Skylake” microprocessors that will target mass market segments and will support DDR4 memory. As a result, the latter will gain market share. Nonetheless, DDR4 will remain more expensive than DDR3 in the coming quarters, according to Micron Technology. At …

Toshiba Corp. is reportedly seeking a partnership with Nanya Technology in a bid to better compete against Samsung Electronics and SK Hynix on the market of multi-chip packages (MCP) for mobile and embedded devices. Toshiba wants to partner with Nanya to secure a stable supply of dynamic random access memory …

Samsung Electronics has announced that it has started mass production of 8Gb LPDDR4 memory chips for next-generation smartphones based on advanced application processors. The new handsets will feature displays with ultra-high-definition resolutions as well as new-generation system-on-chips, such as Qualcomm Snapdragon 810. At present Samsung manufactures 8Gb and 6Gb LPDDR4 …

Toshiba Corp. and SK Hynix have announced that they had reached a settlement agreement in connection with a civil lawsuit that the former initiated against the latter at the Tokyo District Court earlier this year. Toshiba accused SK Hynix of stealing intellectual property related to NAND flash memory. As a …

SK Hynix, a major maker of high-performance memory, has added high bandwidth memory (HBM) devices compliant with the JESD235 specification into its product catalogue for the fourth quarter of 2014. The addition of chips into the databook means that they are in production and can be obtained from the company. …

Samsung Electronics has begun to produce 8Gb DDR4 memory chips. The new memory devices will power 32GB DDR4 modules and open the doors to 128GB DDR4 memory modules for high-end enterprise-class servers. The 8Gb DDR4 ICs are produced using 20nm fabrication process. Samsung’s 8Gb DDR4 memory chip can operate at …

Although Samsung Electronics plans to significantly boost its production capacities in the coming years, the company does not expect prices of dynamic random access memory to drop in 2015. Chief executive officer of the company is confident that DRAM prices will continue to be favourable for manufacturers. “We'll have to …

Although Apple is not the world’s largest supplier of personal computers, smartphones or tablets, it sells so many products that by 2015 it will consume 25 per cent of LPDDR memory produced in the world, according to analysts from TrendForce. At present Apple uses LPDDR3 memory inside its iPhones, iPads and MacBook …

Samsung Electronics this week said that is has begun to mass produce 6Gb LPDDR3 memory devices using 20nm process technology. The new mobile DRAM ICs will be used to create 3GB LPDDR3 packages for high-performance smartphones and tablets. The thin process technology will make the new LPDDR3 solutions more energy-efficient …

Samsung Electronics on Tuesday said that has started to produce 64GB DDR4 memory modules that are powered by DDR4 memory chips that feature three dimensional (3D) “through silicon via” (TSV) package technology. The DRAM [dynamic random access memory] modules are designed for enterprise servers. Samsung’s 64GB registered dual inline memory …

JEDEC, an organization that defines standards for computer memory, on Monday announced that it had finalized the LPDDR4, a next-generation standard for mobile DRAM [dynamic random access memory]. The new technology will enable data rates of up to 4266MT/s and will significantly boost performance of mobile devices, such as smartphones …

Just as expected, prices of dynamic random access memory (DRAM) started to increase in the second half of July as major PC makers and OEMs began to stockpile memory to meet demand for their products during the back-to-school season. In addition to BTS, it is expected that the corporate PC …

Although Samsung Electronics and SK Hynix have been sampling LPDDR4 memory for mobile devices for well over half of a year now, actual devices featuring the new type of low-power dynamic random access memory will not hit the market until the second half of next year. According to market analysts, …

Micron Technology on Monday introduced the industry’s first monolithic 8Gb DDR3 memory component. Previously 8Gb memory chips were made by stacking together several 2Gb or 4Gb devices. 8Gb monolithic components will enable cost-effective, high-capacity solutions for servers. “The ability to scale with our customers' accelerating memory demand was a key …

Although the price of dynamic random access memory (DRAM) remained rather stable in the recent months, it will increase by 5 – 10 per cent in the third quarter, according to Mark Newman, an analyst with Bernstein Research. Nonetheless, a good news is that the industry will likely move to …

Smart Modular Technologies, a leading independent maker of specialty memory and storage solutions, said Thursday that it has begun shipments of DDR4 memory modules in sample quantities. The DDR4 memory modules are designed for servers, micro-servers, workstations, storage and networking applications. Currently, Smart Modular's lineup of available DDR4-2133 1.2V modules …

Toshiba Corp. and SanDisk Corp. on Monday announced that they had licensed intellectual property from Intermolecular. The technologies, which were developed under the collaborative development program (CDP) as well as Intermolecular's background intellectual property, are believed to be crucial for next-generation memory. The companies' CDP with Intermolecular, specifically aimed at …

History always repeats itself. Rambus and JEDEC have a history that began in the early nineties and greatly influenced the whole dynamic random access memory (DRAM) industry in the 2000s and 2010s. That history is about to repeat itself. Rambus, a developer of high-speed interfaces and owner of multiple standard-essential …

Despite of expectations that Micron Technology will increase computer memory prices this month because its rivals cannot meet all demand, the actual increases were not significant and average contract prices of DRAM [dynamic random access memory]  in May are projected to remain generally on the same level as in April. …

The prices of dynamic random access memory (DRAM) may start to increase this month as two out of three major computer memory makers are experiencing problems with fulfilling market demands. In case the situation with under-supply of DRAM is not resolved, the high prices will remain for several months down …

Samsung Electronics on Tuesday said that it had begun mass production of dynamic random access memory using 20nm process technology. The new fabrication tech will not only enable the company to produce more energy-efficient DDR3 memory, but will also reduce manufacturing cost of DRAM and will thus make it more …

Samsung Electronics, the world’s No. 1 maker of DRAM, may further improve its market share by boosting output of memory produced using leading-edge manufacturing process, according to industry analysts. The company is reportedly increasing production of dynamic random access memory using 25nm process technology, which is a threat to Micron …