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James Dawson

Intel EMIB silicon helps chips talk to each other

Many of today’s devices including smartphones, computers and servers contain multiple smaller chips sealed inside a larger, usually rectangular package, communicating with each other via a complex multi-layered piece of silicon no bigger than a grain of rice. In the case of Intel powered devices, this communication between chips including …

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Lian Li announce the Lancool II case

Lian Li has announced an update to its Lancool chassis series. The Lian Li Lancool II is a revised and improved version of the original Lancool One. The new case is available in either black or white and is packed with features to improve the PC building experience. Easy access …

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